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EP 4 512 033 A1

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(43) Date of publication: 26.02.2025 Bulletin 2025/09 (21) Application number: 23792509.4 (22) Date of filing: 20.04.2023

(51) International Patent Classification (IPC):  H04L 5/00(2006.01) H04W 72/232(2023.01) (52) Cooperative Patent Classification (CPC): H04W 72/232; H04L 5/0032; H04L 5/001; H04L 5/0044; H04L 5/0053; H04L 5/0023; H04L 5/0092 (86) International application number: PCT/US2023/019196 (87) International publication number: WO 2023/205293 (26.10.2023 Gazette 2023/43)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 22.04.2022 US 202263333762 P 28.04.2022 US 202263336050 P 16.06.2022 US 202263352914 P 01.11.2022 US 202263421373 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)

(72) Inventors: LI, Yingyang Beijing, Hebei 100032 (CN) WANG, Yi Beijing, Hebei 10000 (CN) XIONG, Gang Portland, Oregon 97229 (US) (74) Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte  Am Brauhaus 8 01099 Dresden 01099 Dresden (DE)