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(11)

EP 4 515 600 A1

(12)

(43) Date of publication: 05.03.2025 Bulletin 2025/10 (21) Application number: 23833238.1 (22) Date of filing: 15.11.2023

(51) International Patent Classification (IPC):  H01L 25/07(2006.01) H01L 23/495(2006.01) (52) Cooperative Patent Classification (CPC): H01L 25/072; H01L 23/49575; H01L 23/49531; H01L 23/49562; H01L 23/49524; H01L 24/73; H01L 24/48; H01L 24/37; H01L 23/49517; H01L 24/40; H01L 23/3735; H01L 2224/73265; H01L 2224/48137; H01L 2224/48247; H01L 2224/40227; H01L 2224/73221 (86) International application number: PCT/US2023/079735 (87) International publication number: WO 2024/107791 (23.05.2024 Gazette 2024/21)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 16.11.2022 US 202263383932 P 14.11.2023 US 202318508551 (71) Applicant: Semiconductor Components Industries, LLC Scottsdale, AZ 85250 (US)	(72) Inventors: PRAJUCKAMOL, Atapol Thanyaburi, 12130 (TH) CHEW, Chee Hiong Seremban, 70300 (MY) (74) Representative: Manitz Finsterwald Patent- und Rechtsanwaltspartnerschaft mbB  Martin-Greif-Strasse 1 80336 München 80336 München (DE)