TECHNICAL FIELD
[0001] This invention relates to the field of analog circuit design technology, and in particular
to a reference voltage generation circuit and an automotive-grade chip.
BACKGROUND
[0002] With the rapid development of automobile industry and semiconductor industry, the
automobile industry is in the era of scientific and technological innovation. In the
future, automobiles will mainly develop in the direction of new energy, safety and
intelligence, and new energy vehicles, intelligent networking and driverless technology
will become the main trends. Automotive-grade chips are the basis of automotive electronics.
At present, electronic products account for more than 50% of the vehicle cost, which
has led to extensive investment in the design and development of the automotive-grade
chips in the semiconductor industry in recent years.
[0003] Requirements for a temperature tolerance of a chip vary with the position and environment
of the chip in the vehicle body. AEC_Q100, an automotive-grade standard launched by
the North American automotive industry, divides a temperature tolerance of the automotive-grade
chip into four grades. For Grade 0, a normal operating temperature of the chip is
-40°C~150°C; for Grade 1, the normal operating temperature of the chip is - 40°C~125°C;
for Grade 2, the normal operating temperature of the chip is -40°C~105°C; and for
Grade 3, the normal operating temperature of the chip is -40°C~85°C. At high temperatures
exceeding 125°C, the leakage problem of MOS (abbreviation of MOSFET (Metal-Oxide-Semiconductor
Field-Effect Transistor)) devices becomes more and more significant, and seriously
affects the performance of analog circuits, which is one of the design difficulties
that distinguish the automotive-grade chips from ordinary consumer-grade chips.
SUMMARY
[0004] This invention aims to provide a reference voltage generation circuit and an automotive-grade
chip, which can effectively solve the leakage problem of MOS devices.
[0005] An aspect of the present invention provides a reference voltage generation circuit.
The reference voltage generation circuit comprises a biasing and voltage-limiting
circuit, a proportional to absolute temperature (PTAT) current generation circuit,
a zero-temperature coefficient reference voltage generation circuit, and a start-up
circuit. The PTAT current generation circuit is configured to generate a PTAT current
and comprises a first branch circuit, a second branch circuit, and a first resistor,
the first branch circuit and the second branch circuit forming a current mirror, the
first branch circuit comprising a first P-channel MOS transistor and a first N-channel
MOS transistor, and the second branch circuit comprising a second P-channel MOS transistor
and a second N-channel MOS transistor, wherein a source of the first P-channel MOS
transistor and a source of the second P-channel MOS transistor are both connected
to a power supply, and a gate of the first P-channel MOS transistor is connected to
a gate of the second P-channel MOS transistor; a source of the first N-channel MOS
transistor is connected to ground, a source of the second N-channel MOS transistor
is connected to one end of the first resistor, the other end of the first resistor
is connected to the ground, a gate of the first N-channel MOS transistor is connected
to a gate of the second N-channel MOS transistor, a substrate of the first N-channel
MOS transistor and a substrate of the second N-channel MOS transistor are connected
to the ground, and the gate of the second N-channel MOS transistor is connected to
a drain of the second N-channel MOS transistor. An input end of the start-up circuit
is connected to the power supply and the gate of the first P-channel MOS transistor,
and an output end of the start-up circuit is connected to a drain of the first N-channel
MOS transistor. The biasing and voltage-limiting circuit is connected to the drain
of the first N-channel MOS transistor to limit an operating voltage of the first N-channel
MOS transistor. The zero-temperature coefficient reference voltage generation circuit
comprises a second resistor and a bipolar junction transistor, wherein one end of
the second resistor is connected to a reference voltage output end, the other end
of the second resistor is connected to an emitter electrode of the bipolar junction
transistor, and a collector electrode and a base electrode of the bipolar junction
transistor are connected to the ground. The PTAT current generated by the PTAT current
generation circuit flows through the second resistor to generate a PTAT voltage, which
is superposed with a negative temperature coefficient voltage between the base electrode
and the emitter electrode of the bipolar junction transistor to generate a zero-temperature
coefficient reference voltage at the reference voltage output end.
[0006] In a particular embodiment, the first branch circuit further comprises a third P-channel
MOS transistor, and the second branch circuit further comprises a fourth P-channel
MOS transistor, wherein a drain of the first P-channel MOS transistor is connected
to a source of the third P-channel MOS transistor, a drain of the second P-channel
MOS transistor is connected to a source of the fourth P-channel MOS transistor, a
gate of the third P-channel MOS transistor is connected to a gate of the fourth P-channel
MOS transistor, a drain of the third P-channel MOS transistor is connected to the
drain of the first N-channel MOS transistor, and a drain of the fourth P-channel MOS
transistor is connected to the drain of the second N-channel MOS transistor.
[0007] In a particular embodiment, the zero-temperature coefficient reference voltage generation
circuit further comprises a fifth P-channel MOS transistor and a sixth P-channel MOS
transistor, wherein a source of the fifth P-channel MOS transistor is connected to
the power supply, a drain of the fifth P-channel MOS transistor is connected to a
source of the sixth P-channel MOS transistor, and a gate of the fifth P-channel MOS
transistor is connected to the gate of the second P-channel MOS transistor; and a
gate of the sixth P-channel MOS transistor is connected to the gate of the fourth
P-channel MOS transistor, and a drain of the sixth P-channel MOS transistor is connected
to the end of the second resistor connected to the reference voltage output end.
[0008] In a particular embodiment, the zero-temperature coefficient reference voltage generation
circuit further comprises a third resistor, wherein the third resistor is connected
in parallel with the second resistor and the bipolar junction transistor between the
end of the second resistor connected to the reference voltage output end and the ground.
[0009] In a particular embodiment, different zero-temperature coefficient reference voltages
are generated by adjusting a ratio of a resistance value of the third resistor to
a sum of a resistance value of the second resistor and the resistance value of the
third resistor, so as to adjust the minimum power supply voltage required for the
reference voltage generation circuit.
[0010] In a particular embodiment, the biasing and voltage-limiting circuit comprises a
third N-channel MOS transistor and a fourth resistor, wherein a source of the third
N-channel MOS transistor is connected to one end of the fourth resistor, a drain of
the third N-channel MOS transistor is connected to the gate of the third P-channel
MOS transistor, a gate of the third N-channel MOS transistor is connected to the output
end of the start-up circuit, and a substrate of the third N-channel MOS transistor
is connected to the ground; and the other end of the fourth resistor is connected
to the ground.
[0011] In a particular embodiment, the biasing and voltage-limiting circuit further comprises
a seventh P-channel MOS transistor, an eighth P-channel MOS transistor, and a fifth
resistor, wherein a source of the seventh P-channel MOS transistor is connected to
the power supply, a drain of the seventh P-channel MOS transistor is connected to
a source of the eighth P-channel MOS transistor, and a gate of the seventh P-channel
MOS transistor is connected to a drain of the eighth P-channel MOS transistor and
one end of the fifth resistor; and a gate of the eighth P-channel MOS transistor is
connected to the other end of the fifth resistor and the drain of the third N-channel
MOS transistor.
[0012] In a particular embodiment, at the beginning of power-up of the power supply, the
start-up circuit pulls up the gate of the third N-channel MOS transistor; and upon
completion of start-up of the reference voltage generation circuit, the start-up circuit
is turned off through voltage feedback at the gate of the first P-channel MOS transistor.
[0013] In a particular embodiment, in the PTAT current generation circuit, the first P-channel
MOS transistor, the third P-channel MOS transistor, the second P-channel MOS transistor,
and the fourth P-channel MOS transistor form a current mirror with a mirror ratio
of 1:1, and the second N-channel MOS transistor and the first N-channel MOS transistor
are mirrored in a ratio of 5:1.
[0014] In a particular embodiment, the seventh P-channel MOS transistor and the eighth P-channel
MOS transistor in the biasing and voltage-limiting circuit and the first P-channel
MOS transistor and the third P-channel MOS transistor in the PTAT current generation
circuit form a current mirror with a mirror ratio of 1:1, and the fourth resistor
has a resistance value equal to that of the first resistor.
[0015] In a particular embodiment, the fifth P-channel MOS transistor and the sixth P-channel
MOS transistor in the zero-temperature coefficient reference voltage generation circuit
and the first P-channel MOS transistor and the third P-channel MOS transistor in the
PTAT current generation circuit form a current mirror with a mirror ratio of 3:1,
the third resistor has a resistance value three times that of the second resistor,
and the resistance value of the second resistor is 7.2 times that of the first resistor.
[0016] Another aspect of the present invention provides an automotive-grade chip, comprising
the reference voltage generation circuit as described above.
[0017] With the reference voltage generation circuit and the automotive-grade chip comprising
the reference voltage generation circuit according to the present invention, the leakage
problem of MOS devices can be effectively solved, and thus the problem that the zero-temperature
coefficient reference voltage varies with the power supply voltage and temperature
due to an increase in the power supply voltage or the temperature can be solved.
[0018] In addition, with the reference voltage generation circuit and the automotive-grade
chip comprising the reference voltage generation circuit according to the present
invention, the limitation on the minimum operating voltage in the circuit structure
can be overcome.
BRIEF DESCRIPTION OF DRAWINGS
[0019]
FIG. 1 is a circuit structure diagram of a reference voltage generation circuit.
FIG. 2 is a circuit structure diagram of another reference voltage generation circuit.
FIG. 3 is a circuit structure diagram of a reference voltage generation circuit according
to an embodiment of the present invention.
DETAILED DESCRIPTION
[0020] Reference will now be made in detail to exemplary embodiments, examples of which
are illustrated in the accompanying drawings. When the following description refers
to the drawings, the same numerals in different drawings indicate the same or similar
elements, unless otherwise indicated. Embodiments described in the following exemplary
embodiments are not intended to be representative of all embodiments consistent with
the present invention. Rather, they are merely examples of apparatuses consistent
with some aspects of the present invention as detailed in the appended claims.
[0021] Terminology used in the embodiments of the present invention is for the purpose of
describing particular embodiments only and is not intended to be limiting of the present
invention. Unless otherwise defined, technical or scientific terms used in the embodiments
of the present invention shall have their ordinary meanings as understood by a person
of ordinary skill in the art to which the present invention belongs. The terms "first,"
"second," and the like, as used in the specification and claims of the present invention
are not intended to denote any order, quantity, or importance, but are merely used
to distinguish one element from another. Similarly, the terms "a" or "an" and the
like are not intended to denote a limitation on quantity, but rather denote the presence
of at least one. "A plurality of" or "several" means two or more. Unless otherwise
indicated, the terms "front," "rear," "left," "right," "away from," "close to," "top,"
and/or "bottom" and the like are for convenience of description only and are not limited
to a position or a spatial orientation. The terms "include" or "comprise" and the
like are intended to mean that an element or item before "include" or "comprise" encompasses
elements or items listed after "include" or "comprise" and equivalents thereof, without
excluding other elements or items. The terms "connect" or "couple" and the like are
not limited to physical or mechanical connections, but may include electrical connections,
whether direct or indirect. As used in the specification and the appended claims of
the present invention, singular forms of "a," "an," "said," and "the" are intended
to include plural forms as well, unless clearly indicated otherwise in the context.
It should also be understood that the term "and/or" as used herein refers to and encompasses
any or all possible combinations of one or more of the associated listed items.
[0022] FIG. 1 illustrates a circuit structure diagram of a reference voltage generation
circuit 10. The reference voltage generation circuit 10 has a simple structure, low
power consumption, and small area. The reference voltage generation circuit 10 is
widely used in scenarios where requirement for the accuracy of the reference voltage
is not so high.
[0023] As shown in FIG. 1, the reference voltage generation circuit 10 generates a zero-temperature
coefficient reference voltage expressed as follows:

where VREF is the zero-temperature coefficient reference voltage generated by the
reference voltage generation circuit 10, VBE is a negative temperature coefficient
voltage between a base electrode and an emitter electrode of a bipolar junction transistor
B1, VGS
MN1 is a voltage between a gate and a source of a first N-channel MOS transistor MN1,
VGS
MN2 is a voltage between a gate and a source of a second N-channel MOS transistor MN2,
and (VGS
MN1-VGS
MN2) is a PTAT (Proportional To Absolute Temperature) voltage generated by the reference
voltage generation circuit 10.
[0024] The zero-temperature coefficient reference voltage VREF can be obtained by superposing
the negative temperature coefficient voltage VBE and the PTAT voltage (VGS
MN1-VGS
MN2), and appropriately setting a ratio of a resistance value of a second resistor R2
to a resistance value of a first resistor R1.
[0025] However, in the reference voltage generation circuit 10 as shown in FIG. 1, the voltage
at point A is VGS
MN1, and the voltage at point B is (VDD-VGS
MP2), where VDD is a power supply voltage, and VGS
MP2 is a voltage between a gate and a source of a second P-channel MOS transistor MP2.
When the power supply voltage VDD is relatively higher, for example, greater than
5V, a voltage difference between the point A and the point B is relatively larger,
which may lead to a mirror mismatch in a current mirror formed by the first N-channel
MOS transistor MN1 and the second N-channel MOS transistor MN2, resulting in a variation
of the zero-temperature coefficient reference voltage VREF with the power supply voltage
VDD.
[0026] FIG. 2 illustrates a circuit structure diagram of another reference voltage generation
circuit 20. As shown in FIG. 2, in order to solve the above problem, a third N-channel
MOS transistor MN3 is usually superposed at the second N-channel MOS transistor MN2
to form a cascode structure to shield the high voltage of (VDD-VGS
MP2). In this way, the voltage at the point B becomes (VB-VGS
MN3), where VB is a bias voltage applied to a gate of the third N-channel MOS transistor
MN3, and VGS
MN3 is a voltage between the gate and a source of the third N-channel MOS transistor
MN3. The design in which the third N-channel MOS transistor MN3 is added as shown
in FIG. 2 is autonomously controllable, and the voltage at the point B can be close
to the voltage at the point A by adjusting a voltage value of the bias voltage VB
at the gate of the third N-channel MOS transistor MN3.
[0027] The design as shown in FIG. 2 can be used in application environments for consumer-grade
produces with operating temperatures ranging from -40°C to 85°C. However, for industrial-grade
products or even automotive-grade products, after the high temperature reaches 125°C
or more, (VB-VGS
MN3) is generally designed to have a value of several hundred millivolts due to the fact
that a source voltage of the third N-channel MOS transistor MN3 is greater than a
substrate voltage of the third N-channel MOS transistor MN3. As a result, the third
N-channel MOS transistor MN3 exhibits a significant substrate bias effect, generating
a leakage current on the order of tens to hundreds of nanoamperes at a substrate thereof.
A value of the leakage current increases as the power supply voltage VDD increases,
and increases as the temperature increases, which, in turn, causes the zero-temperature
coefficient reference voltage, VREF, to vary with the power supply voltage VDD and
the temperature.
[0028] In the above circuit structure, in addition to an increase in the leakage current
due to high temperature, the PTAT voltage (VGS
MN1-VGS
MN2) is relatively low, resulting in a relatively high voltage value of the operating
voltage in the circuit structure, which exceeds 1.4V in practice, in order to obtain
the zero-temperature coefficient reference voltage, VREF. This greatly limits the
minimum operating voltage in the circuit structure.
[0029] In view of this, the present invention provides a reference voltage generation circuit
30 capable of solving the problem that the zero-temperature coefficient reference
voltage VREF varies with the power supply voltage VDD and temperature due to an increase
in the power supply voltage VDD or the temperature. In addition, the reference voltage
generation circuit 30 according to the present invention can overcome the limitation
on the minimum operating voltage in the circuit structure.
[0030] FIG. 3 illustrates a circuit structure diagram of a reference voltage generation
circuit 30 according to an embodiment of the present invention. The reference voltage
generation circuit 30 can be applied to automotive-grade chips and can withstand high
temperature and high voltage. As shown in FIG. 3, the reference voltage generation
circuit 30 according to an embodiment of the present invention includes a biasing
and voltage-limiting circuit 34, a proportional to absolute temperature (PTAT) current
generation circuit 31, a zero-temperature coefficient reference voltage generation
circuit 32, and a start-up circuit 33.
[0031] The PTAT current generation circuit 31 is configured to generate a PTAT current.
The PTAT current generation circuit 31 includes a first branch circuit, a second branch
circuit, and a first resistor R1, with the first branch circuit and the second branch
circuit forming a current mirror. The first branch circuit includes a first P-channel
MOS transistor MP1 and a first N-channel MOS transistor MN1, and the second branch
circuit includes a second P-channel MOS transistor MP2 and a second N-channel MOS
transistor MN2. A source of the first P-channel MOS transistor MP1 and a source of
the second P-channel MOS transistor MP2 are both connected to a power supply, and
a gate of the first P-channel MOS transistor MP1 is connected to a gate of the second
P-channel MOS transistor MP2. A source of the first N-channel MOS transistor MN1 is
connected to ground VSS, a source of the second N-channel MOS transistor MN2 is connected
to one end of the first resistor R1, the other end of the first resistor R1 is connected
to the ground VSS, a gate of the first N-channel MOS transistor MN1 is connected to
a gate of the second N-channel MOS transistor MN2, a substrate of the first N-channel
MOS transistor MN1 and a substrate of the second N-channel MOS transistor MN2 are
connected to the ground VSS, and the gate of the second N-channel MOS transistor MN2
is connected to a drain of the second N-channel MOS transistor MN2.
[0032] An input end of the start-up circuit 33 is connected to the power supply and the
gate of the first P-channel MOS transistor MP1, and an output end of the start-up
circuit 33 is connected to a drain of the first N-channel MOS transistor MN1.
[0033] The biasing and voltage-limiting circuit 34 is connected to the drain of the first
N-channel MOS transistor MN1 to limit an operating voltage of the first N-channel
MOS transistor MN1.
[0034] The zero-temperature coefficient reference voltage generation circuit 32 includes
a second resistor R2 and a bipolar junction transistor B1, where one end of the second
resistor R2 is connected to a reference voltage output end, the other end of the second
resistor R2 is connected to an emitter electrode of the bipolar junction transistor
B, and a collector electrode and a base electrode of the bipolar junction transistor
B1 are connected to the ground VSS.
[0035] The PTAT current generated by the PTAT current generation circuit 31 flows through
the second resistor R2 to generate a PTAT voltage, which is superposed with a negative
temperature coefficient voltage between the base electrode and the emitter electrode
of the bipolar junction transistor B1 to generate a zero-temperature coefficient reference
voltage VREF at the reference voltage output end.
[0036] In the circuit structure of the reference voltage generation circuit 30 according
to the present invention, the first N-channel MOS transistor MN1 and the second N-channel
MOS transistor MN2, as the core devices, both operate under the condition of a low
substrate bias, and the voltage-limiting circuit is used to limit the operating voltage
of the key MOS devices, such that the leakage of the key MOS devices under the condition
of high temperature and high voltage can be ignored.
[0037] In some embodiments, the first branch circuit in the PTAT current generation circuit
31 further includes a third P-channel MOS transistor MP3, and the second branch circuit
in the PTAT current generation circuit 31 further includes a fourth P-channel MOS
transistor MP4. A drain of the first P-channel MOS transistor MP1 is connected to
a source of the third P-channel MOS transistor MP3, a drain of the second P-channel
MOS transistor MP2 is connected to a source of the fourth P-channel MOS transistor
MP4, a gate of the third P-channel MOS transistor MP3 is connected to a gate of the
fourth P-channel MOS transistor MP4, a drain of the third P-channel MOS transistor
MP3 is connected to the drain of the first N-channel MOS transistor MN1, and a drain
of the fourth P-channel MOS transistor MP4 is connected to the drain of the second
N-channel MOS transistor MN2. Therefore, the mirror accuracy of the current mirror
formed by the first branch circuit and the second branch circuit can be improved.
[0038] In some embodiments, the zero-temperature coefficient reference voltage generation
circuit 32 further includes a fifth P-channel MOS transistor MP5 and a sixth P-channel
MOS transistor MP6. A source of the fifth P-channel MOS transistor MP5 is connected
to the power supply, a drain of the fifth P-channel MOS transistor MP5 is connected
to a source of the sixth P-channel MOS transistor MP6, and a gate of the fifth P-channel
MOS transistor MP5 is connected to the gate of the second P-channel MOS transistor
MP2. A gate of the sixth P-channel MOS transistor MP6 is connected to the gate of
the fourth P-channel MOS transistor MP4, and a drain of the sixth P-channel MOS transistor
MP6 is connected to the end of the second resistor R2 connected to the reference voltage
output end.
[0039] In some embodiments, the zero-temperature coefficient reference voltage generation
circuit 32 further includes a third resistor R3. The third resistor R3 is connected
in parallel with the second resistor R2 and the bipolar junction transistor B1 between
the end of the second resistor R2 connected to the reference voltage output end and
the ground VSS.
[0040] Therefore, with the second resistor R2 and the third resistor R3, the generated zero-temperature
coefficient reference voltage VREF has a voltage division ratio, that is, a ratio
of a resistance value of the third resistor R3 to a sum of a resistance value of the
second resistor R2 and the resistance value of the third resistor R3, which can reduce
a voltage value of the zero-temperature coefficient reference voltage VREF. Different
zero-temperature coefficient reference voltages VREF can be generated by adjusting
the ratio of the resistance value of the third resistor R3 to the sum of the resistance
value of the second resistor R2 and the resistance value of the third resistor R3,
so as to adjust the minimum power supply voltage VDD required for the reference voltage
generation circuit 30, which is beneficial for the reference voltage generation circuit
30 to operate at a low power supply voltage VDD.
[0041] In some embodiments, the biasing and voltage-limiting circuit 34 may include a third
N-channel MOS transistor MN3 and a fourth resistor R4. A source of the third N-channel
MOS transistor MN3 is connected to one end of the fourth resistor R4, a drain of the
third N-channel MOS transistor MN3 is connected to the gate of the third P-channel
MOS transistor MP3, a gate of the third N-channel MOS transistor MN3 is connected
to the output end of the start-up circuit 33, and a substrate of the third N-channel
MOS transistor MN3 is connected to the ground VSS; and the other end of the fourth
resistor R4 is connected to the ground VSS.
[0042] In some embodiments, the biasing and voltage-limiting circuit 34 further includes
a seventh P-channel MOS transistor MP7, an eighth P-channel MOS transistor MP8, and
a fifth resistor R5. A source of the seventh P-channel MOS transistor MP7 is connected
to the power supply, a drain of the seventh P-channel MOS transistor MP7 is connected
to a source of the eighth P-channel MOS transistor MP8, and a gate of the seventh
P-channel MOS transistor MP7 is connected to a drain of the eighth P-channel MOS transistor
MP8 and one end of the fifth resistor R5; and a gate of the eighth P-channel MOS transistor
MP8 is connected to the other end of the fifth resistor R5 and the drain of the third
N-channel MOS transistor MN3.
[0043] The output end of the start-up circuit 33 is connected to the gate of the third N-channel
MOS transistor MN3. At the beginning of power-up of the power supply, the start-up
circuit 33 may pull up the gate of the third N-channel MOS transistor MN3. Upon completion
of start-up of the reference voltage generation circuit 30, the start-up circuit 33
may be turned off through voltage feedback at the gate of the first P-channel MOS
transistor MP1, so as not to affect the normal operation of the reference voltage
generation circuit 30.
[0044] The operation principle of the reference voltage generation circuit 30 according
to the present invention will be described below with reference to FIG. 3.
[0045] As shown in FIG. 3, the PTAT current generated by the PTAT current generation circuit
31 is as follows:

where I
PTAT is the PTAT current generated by the PTAT current generation circuit 31, VGS
MN1 is the voltage between the gate and source of the first N-channel MOS transistor
MN1, and VGS
MN2 is the voltage between the gate and source of the second N-channel MOS transistor
MN2.
[0046] The fifth P-channel MOS transistor MP5 mirrors the PTAT current of the second P-channel
MOS transistor MP2, and the zero-temperature coefficient reference voltage generation
circuit 32 superposes the PTAT current I
PTAT with a negative temperature coefficient current VBE/R
2 to obtain the zero-temperature coefficient reference voltage VREF, as shown below:

where VBE is a negative temperature coefficient voltage between the base electrode
and emitter electrode of the bipolar junction transistor B1, and (VGS
MN1-VGS
MN2) is the PTAT voltage.
[0047] The zero-temperature coefficient reference voltage VREF can be obtained by superposing
the negative temperature coefficient voltage VBE with the PTAT voltage (VGS
MN1-VGS
MN2) and appropriately setting a ratio of the resistance value of the second resistor
R2 to a resistance value of the first resistor R1.
[0048] By appropriately setting the ratio of the resistance value of the third resistor
R3 to the sum of the resistance value of the second resistor R2 and the resistance
value of the third resistor R3, the voltage value of the zero-temperature coefficient
reference voltage VREF can be reduced, such that the minimum power supply voltage
VDD required for the reference voltage generation circuit 30 can be reduced.
[0049] At the beginning of power-up of the power supply, the start-up circuit 33 pulls up
the voltage at point A as the power supply voltage VDD increases until the third N-channel
MOS transistor MN3 is turned on, and pulls down gate voltages of all the P-channel
MOS transistors, and the voltage at point B increases accordingly. Upon the PTAT current
generation circuit 31 is powered up, the start-up circuit 33 may be turned off through
the voltage feedback at the gate of the first P-channel MOS transistor MP1. Thus,
the start-up process of the reference voltage generation circuit 30 is completed.
[0050] The third N-channel MOS transistor MN3 and the fourth resistor R4 may limit the voltage
at the point A to (ΔVGS
3+I
3×R
4), where ΔVGS
3 is a voltage difference between a gate voltage and a source voltage of the third
N-channel MOS transistor MN3, I
3 is a value of current flowing through the fourth resistor R4, and R
4 is a resistance value of the fourth resistor R4. The voltage at the point B is (ΔVGS
2+I
1xR
1), where ΔVGS
2 is a voltage difference between a gate voltage and a source voltage of the second
N-channel MOS transistor MN2, I
1 is a value of current flowing through the first resistor R1, and R
1 is the resistance value of the first resistor R1. The voltage at the point A is close
to the voltage at the point B, and a current mirror formed by the first N-channel
MOS transistor MN1 and the second N-channel MOS transistor MN2 has a relatively high
mirror accuracy. A drain voltage of the first N-channel MOS transistor MN1 (i.e.,
the voltage at the point A) is limited, and meanwhile, the source and substrate of
the first N-channel MOS transistor MN1 are both connected to the ground VSS, thus
the first N-channel MOS transistor MN1 exhibits no substrate bias effect, and the
influence of leakage of the first N-channel MOS transistor MN1 can be ignored.
[0051] The voltage at the point B is limited by the second N-channel MOS transistor MN2,
and has a value of (ΔVGS
2+I
1×R
1), and the second N-channel MOS transistor MN2 has a substrate bias voltage of (I
1×R
1), which is usually several tens of millivolts. The voltage at the point B is limited,
and meanwhile, the substrate bias voltage of the second N-channel MOS transistor MN2
is very low, and thus the influence of leakage of the second N-channel MOS transistor
MN2 can be ignored.
[0052] Although the voltage at point C increases with the increase in the power supply voltage
VDD, the third N-channel MOS transistor MN3 has a substrate bias voltage of (I
3×R
4), which is usually several tens of millivolts, and thus the influence of leakage
of the third N-channel MOS transistor MN3 can also be ignored.
[0053] Therefore, the reference voltage generation circuit 30 according to the present invention
can realize higher performance, reliability, and service life under higher power supply
voltages VDD and automotive-grade high temperature standards.
[0054] Specific examples of the reference voltage generation circuit 30 according to the
present invention are provided below.
[0055] In an embodiment, in the PTAT current generation circuit 31, the first P-channel
MOS transistor MP1, the third P-channel MOS transistor MP3, the second P-channel MOS
transistor MP2, and the fourth P-channel MOS transistor MP4 form a current mirror
with a mirror ratio of 1:1, and the second N-channel MOS transistor MN2 and the first
N-channel MOS transistor MN1 are mirrored in a ratio of 5:1.
[0056] In order to make the voltage at the point A and the voltage at the point B as equal
as possible, the seventh P-channel MOS transistor MP7 and the eighth P-channel MOS
transistor MP8 in the biasing and voltage-limiting circuit 34 and the first P-channel
MOS transistor MP1 and the third P-channel MOS transistor MP3 in the PTAT current
generation circuit 31 form a current mirror with a mirror ratio of 1:1, and the fourth
resistor R4 has a resistance value equal to that of the first resistor R1.
[0057] The fifth P-channel MOS transistor MP5 and the sixth P-channel MOS transistor MP6
in the zero-temperature coefficient reference voltage generation circuit 32 and the
first P-channel MOS transistor MP1 and the third P-channel MOS transistor MP3 in the
PTAT current generation circuit 31 form a current mirror with a mirror ratio of 3:1,
the third resistor R3 has a resistance value three times that of the second resistor
R2, and the resistance value of the second resistor R2 is 7.2 times that of the first
resistor R1.
[0058] At the beginning of power-up of the power supply, the start-up circuit 33 pulls up
the gate of the third N-channel MOS transistor MN3. When current is generated in the
reference voltage generation circuit 30 and the start-up of the reference voltage
generation circuit 30 is completed, the start-up circuit 33 is turned off through
the voltage feedback at the gate of the first P-channel MOS transistor MP1.
[0059] The PTAT current generation circuit 31 generates the PTAT current I
PTAT, the fifth P-channel MOS transistor MP5 mirrors the PTAT current of the second P-channel
MOS transistor MP2, and the zero-temperature coefficient reference voltage generation
circuit 32 superposes the PTAT current with the negative temperature coefficient current
to obtain the zero-temperature coefficient reference voltage VREF, as shown below:

[0060] In this specific example, the resistance value of the third resistor R3 is three
times the resistance value of the second resistor R2, and the resistance value of
the second resistor R2 is 7.2 times the resistance value of the first resistor R1,
resulting in the zero-temperature coefficient reference voltage VREF with a voltage
value of 1.1V or less. By adjusting the ratio of the resistance value of the third
resistor R3 to the sum of the resistance value of the second resistor R2 and the resistance
value of the third resistor R3, R
3/(R
2+R
3), different zero-temperature coefficient reference voltages VREF can be obtained.
[0061] The reference voltage generation circuit 30 according to the present invention can
be used in automotive-grade chips, completing standard testing of AEC_Q100 automotive-grade
chips, and achieving good market application results.
[0062] It should be noted that the above specific design ratio of the reference voltage
generation circuit is only an example, and is not limiting of the reference voltage
generation circuit according to the present invention. The present invention is not
limited to the above specific ratio, and the reference voltage generation circuit
according to the present invention may have different ratios according to different
application scenarios during specific implementation.
[0063] The present invention further provides an automotive-grade chip. The automotive-grade
chip includes the reference voltage generation circuit 30 according to various embodiments
as described above.
[0064] The reference voltage generation circuit and the automotive-grade chip according
to the embodiments of the present invention have been described in detail above. Specific
examples are used herein to describe the reference voltage generation circuit and
the automotive-grade chip according to the embodiments of the present invention. The
description of the above examples is only used to help understand the core idea of
the present invention, and is not intended to limit the present invention. It should
be noted that, for those ordinary skilled in the art, a number of improvements and
modifications may be made to the present invention without departing from the principles
of the present invention, and these improvements and modifications shall fall within
the scope of protection of the appended claims.
1. A reference voltage generation circuit (30),
characterized in that, the reference voltage generation circuit (30) comprises a biasing and voltage-limiting
circuit (34), a proportional to absolute temperature, PTAT, current generation circuit
(31), a zero-temperature coefficient reference voltage generation circuit (32), and
a start-up circuit (33), wherein
the PTAT current generation circuit (31) is configured to generate a PTAT current
and comprises a first branch circuit, a second branch circuit, and a first resistor
(R1), the first branch circuit and the second branch circuit forming a current mirror,
the first branch circuit comprising a first P-channel MOS transistor (MP1) and a first
N-channel MOS transistor (MN1), and the second branch circuit comprising a second
P-channel MOS transistor (MP2) and a second N-channel MOS transistor (MN2), wherein
a source of the first P-channel MOS transistor (MP1) and a source of the second P-channel
MOS transistor (MP2) are both connected to a power supply, and a gate of the first
P-channel MOS transistor (MP1) is connected to a gate of the second P-channel MOS
transistor (MP2); a source of the first N-channel MOS transistor (MN1) is connected
to ground (VSS), a source of the second N-channel MOS transistor (MN2) is connected
to one end of the first resistor (R1), the other end of the first resistor (R1) is
connected to the ground (VSS), a gate of the first N-channel MOS transistor (MN1)
is connected to a gate of the second N-channel MOS transistor (MN2), a substrate of
the first N-channel MOS transistor (MN1) and a substrate of the second N-channel MOS
transistor (MN2) are connected to the ground (VSS), and the gate of the second N-channel
MOS transistor (MN2) is connected to a drain of the second N-channel MOS transistor
(MN2);
an input end of the start-up circuit (33) is connected to the power supply and the
gate of the first P-channel MOS transistor (MP1), and an output end of the start-up
circuit (33) is connected to a drain of the first N-channel MOS transistor (MN1);
the biasing and voltage-limiting circuit (34) is connected to the drain of the first
N-channel MOS transistor (MN1) to limit an operating voltage of the first N-channel
MOS transistor (MN1); and
the zero-temperature coefficient reference voltage generation circuit (32) comprises
a second resistor (R2) and a bipolar junction transistor (B1), wherein one end of
the second resistor (R2) is connected to a reference voltage output end, the other
end of the second resistor (R2) is connected to an emitter electrode of the bipolar
junction transistor (B1), and a collector electrode and a base electrode of the bipolar
junction transistor (B1) are connected to the ground (VSS),
wherein the PTAT current generated by the PTAT current generation circuit (31) flows
through the second resistor (R2) to generate a PTAT voltage, and the PTAT voltage
is superposed with a negative temperature coefficient voltage between the base electrode
and the emitter electrode of the bipolar junction transistor (B1) to generate a zero-temperature
coefficient reference voltage at the reference voltage output end.
2. The reference voltage generation circuit (30) according to claim 1, characterized in that, the first branch circuit further comprises a third P-channel MOS transistor (MP3),
and the second branch circuit further comprises a fourth P-channel MOS transistor
(MP4), wherein a drain of the first P-channel MOS transistor (MP1) is connected to
a source of the third P-channel MOS transistor (MP3), a drain of the second P-channel
MOS transistor (MP2) is connected to a source of the fourth P-channel MOS transistor
(MP4), a gate of the third P-channel MOS transistor (MP3) is connected to a gate of
the fourth P-channel MOS transistor (MP4), a drain of the third P-channel MOS transistor
(MP3) is connected to the drain of the first N-channel MOS transistor (MN1), and a
drain of the fourth P-channel MOS transistor (MP4) is connected to the drain of the
second N-channel MOS transistor (MN2).
3. The reference voltage generation circuit (30) according to claim 2, characterized in that, the zero-temperature coefficient reference voltage generation circuit (32) further
comprises a fifth P-channel MOS transistor (MP5) and a sixth P-channel MOS transistor
(MP6), wherein a source of the fifth P-channel MOS transistor (MP5) is connected to
the power supply, a drain of the fifth P-channel MOS transistor (MP5) is connected
to a source of the sixth P-channel MOS transistor (MP6), and a gate of the fifth P-channel
MOS transistor (MP5) is connected to the gate of the second P-channel MOS transistor
(MP2); and a gate of the sixth P-channel MOS transistor (MP6) is connected to the
gate of the fourth P-channel MOS transistor (MP4), and a drain of the sixth P-channel
MOS transistor (MP6) is connected to the end of the second resistor (R2) connected
to the reference voltage output end.
4. The reference voltage generation circuit (30) according to claim 3, characterized in that, the zero-temperature coefficient reference voltage generation circuit (32) further
comprises a third resistor (R3), wherein the third resistor (R3) is connected in parallel
with the second resistor (R2) and the bipolar junction transistor (B1) between the
end of the second resistor (R2) connected to the reference voltage output end and
the ground (VSS).
5. The reference voltage generation circuit (30) according to claim 4, characterized in that, different zero-temperature coefficient reference voltages are generated by adjusting
a ratio of a resistance value of the third resistor (R3) to a sum of a resistance
value of the second resistor (R2) and the resistance value of the third resistor (R3),
so as to adjust the minimum power supply voltage required for the reference voltage
generation circuit (30).
6. The reference voltage generation circuit (30) according to claim 2, characterized in that, the biasing and voltage-limiting circuit (34) comprises a third N-channel MOS transistor
(MN3) and a fourth resistor (R4), wherein a source of the third N-channel MOS transistor
(MN3) is connected to one end of the fourth resistor (R4), a drain of the third N-channel
MOS transistor (MN3) is connected to the gate of the third P-channel MOS transistor
(MP3), a gate of the third N-channel MOS transistor (MN3) is connected to the output
end of the start-up circuit (33), and a substrate of the third N-channel MOS transistor
(MN3) is connected to the ground (VSS); and the other end of the fourth resistor (R4)
is connected to the ground (VSS).
7. The reference voltage generation circuit (30) according to claim 6, characterized in that, the biasing and voltage-limiting circuit (34) further comprises a seventh P-channel
MOS transistor (MP7), an eighth P-channel MOS transistor (MP8), and a fifth resistor
(R5), wherein a source of the seventh P-channel MOS transistor (MP7) is connected
to the power supply, a drain of the seventh P-channel MOS transistor (MP7) is connected
to a source of the eighth P-channel MOS transistor (MP8), and a gate of the seventh
P-channel MOS transistor (MP7) is connected to a drain of the eighth P-channel MOS
transistor (MP8) and one end of the fifth resistor (R5); and a gate of the eighth
P-channel MOS transistor (MP8) is connected to the other end of the fifth resistor
(R5) and the drain of the third N-channel MOS transistor (MN3).
8. The reference voltage generation circuit (30) according to claim 6, characterized in that, at the beginning of power-up of the power supply, the start-up circuit (33) pulls
up the gate of the third N-channel MOS transistor (MN3); and upon completion of start-up
of the reference voltage generation circuit (30), the start-up circuit (33) is turned
off through voltage feedback at the gate of the first P-channel MOS transistor (MP1).
9. The reference voltage generation circuit (30) according to claim 2, characterized in that, in the PTAT current generation circuit (31), the first P-channel MOS transistor
(MP1), the third P-channel MOS transistor (MP3), the second P-channel MOS transistor
(MP2), and the fourth P-channel MOS transistor (MP4) form a current mirror with a
mirror ratio of 1:1, and the second N-channel MOS transistor (MN2) and the first N-channel
MOS transistor (MN1) are mirrored in a ratio of 5:1.
10. The reference voltage generation circuit (30) according to claim 7, characterized in that, the seventh P-channel MOS transistor (MP7) and the eighth P-channel MOS transistor
(MP8) in the biasing and voltage-limiting circuit (34) and the first P-channel MOS
transistor (MP1) and the third P-channel MOS transistor (MP3) in the PTAT current
generation circuit (31) form a current mirror with a mirror ratio of 1:1, and the
fourth resistor (R4) has a resistance value equal to that of the first resistor (R1).
11. The reference voltage generation circuit (30) according to claim 4, characterized in that, the fifth P-channel MOS transistor (MP5) and the sixth P-channel MOS transistor
(MP6) in the zero-temperature coefficient reference voltage generation circuit (32)
and the first P-channel MOS transistor (MP1) and the third P-channel MOS transistor
(MP3) in the PTAT current generation circuit (31) form a current mirror with a mirror
ratio of 3:1, the third resistor (R3) has a resistance value three times that of the
second resistor (R2), and the resistance value of the second resistor (R2) is 7.2
times that of the first resistor (R1).
12. An automotive-grade chip, characterized in that, the automotive-grade chip comprises the reference voltage generation circuit (30)
according to any one of claims 1 to 11.