(19)

(11)

EP 4 523 252 A1

(12)

(43) Date of publication: 19.03.2025 Bulletin 2025/12 (21) Application number: 23803974.7 (22) Date of filing: 29.03.2023

(51) International Patent Classification (IPC):  H01L 23/00(2006.01) (52) Cooperative Patent Classification (CPC): H01L 25/0657; H01L 2225/06524; H01L 2225/06565 (86) International application number: PCT/US2023/016683 (87) International publication number: WO 2023/219720 (16.11.2023 Gazette 2023/46)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 09.05.2022 US 202217662493 09.05.2022 US 202217662501 09.09.2022 US 202217930858 (71) Applicant: Sandisk Technologies, Inc. Milpitas, CA 95035 (US)	(72) Inventors: CHEN, Linghan Addison, Texas 75001 (US) HOU, Lin Addison, Texas 75001 (US) TOTANI, Shingo Addison, Texas 75001 (US) AMANO, Fumitaka Addison, Texas 75001 (US) ISHIKAWA, Kensuke Addison, Texas 75001 (US) (74) Representative: Murgitroyd & Company  165-169 Scotland Street Glasgow G5 8PL Glasgow G5 8PL (GB)