(19)

(11)

EP 4 527 036 A1

(12)

(43) Date of publication: 26.03.2025 Bulletin 2025/13 (21) Application number: 23733098.0 (22) Date of filing: 18.05.2023

(51) International Patent Classification (IPC):  H04L 5/00(2006.01) (52) Cooperative Patent Classification (CPC): H04L 5/0053; H04L 5/0091; H04L 5/005; H04L 5/001 (86) International application number: PCT/US2023/022755 (87) International publication number: WO 2023/225210 (23.11.2023 Gazette 2023/47)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 19.05.2022 US 202263364993 P 17.05.2023 US 202318319377 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: LEI, Jing San Diego, California 92121 (US) WU, Yongle San Diego, California 92121 (US) LI, Yong San Diego, California 92121 (US) GAAL, Peter San Diego, California 92121 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)