(19)
(11) EP 4 527 106 A1

(12)

(43) Date of publication:
26.03.2025 Bulletin 2025/13

(21) Application number: 23726750.5

(22) Date of filing: 28.04.2023
(51) International Patent Classification (IPC): 
H04W 24/10(2009.01)
H04W 8/18(2009.01)
H04W 88/06(2009.01)
(52) Cooperative Patent Classification (CPC):
H04W 88/06; H04W 8/183; H04W 24/10
(86) International application number:
PCT/US2023/020449
(87) International publication number:
WO 2023/224789 (23.11.2023 Gazette 2023/47)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 16.05.2022 US 202263364776 P
27.04.2023 US 202318308340

(71) Applicant: Qualcomm Incorporated
San Diego, CA 92121-1714 (US)

(72) Inventors:
  • OZTURK, Ozcan
    San Diego, CA 92121 (US)
  • SHAHIDI, Reza
    San Diego, CA 92121 (US)
  • SANTHANAM, Arvind, Vardarajan
    San Diego, CA 92121 (US)

(74) Representative: Jaeger, Michael David 
Maucher Jenkins Seventh Floor Offices Artillery House 11-19 Artillery Row
London SW1P 1RT
London SW1P 1RT (GB)

   


(54) MULTIPLE USER SUBSCRIBER IDENTITY MODULE GAP PATTERN MODIFICATION