THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COMPOSITE BACKSIDE METAL FILL STRUCTURES AND METHODS FOR FORMING THE SAME - Patent 4537396

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EP 4 537 396 A1

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(43)	Date of publication:
	16.04.2025 Bulletin 2025/16

(21)	Application number: 23820229.5

(22)	Date of filing: 31.03.2023

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International Patent Classification (IPC):

H01L 23/522^(2006.01)

H10B 41/27^(2023.01)

(52)	Cooperative Patent Classification (CPC):
	H10B 43/27; H10B 43/50; H10B 43/10

(86)	International application number:
	PCT/US2023/017061

(87)	International publication number:
	WO 2023/239442 (14.12.2023 Gazette 2023/50)

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
	Designated Extension States:
	BA
	Designated Validation States:
	KH MA MD TN

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Priority:

10.06.2022 US 202217806415
10.06.2022 US 202217806406

(71)	Applicant: Sandisk Technologies, Inc.
	Milpitas, CA 95035 (US)

(72)	Inventors:
	AMANO, Fumitaka San Jose, California 95119 (US) KAMBAYASHI, Ryo San Jose, California 95119 (US) SHARANGPANI, Rahul San Jose, California 95119 (US) MAKALA, Raghuveer S. San Jose, California 95119 (US)

(74)	Representative: Murgitroyd & Company
	165-169 Scotland Street Glasgow G5 8PL Glasgow G5 8PL (GB)

(54)	THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COMPOSITE BACKSIDE METAL FILL STRUCTURES AND METHODS FOR FORMING THE SAME