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(11)

EP 4 537 423 A1

(12)

(43) Date of publication: 16.04.2025 Bulletin 2025/16 (21) Application number: 22945990.4 (22) Date of filing: 09.06.2022

(51) International Patent Classification (IPC):  H01Q 1/12(2006.01) H02J 50/00(2016.01) H02J 50/20(2016.01) H10N 10/00(2023.01) (52) Cooperative Patent Classification (CPC): H02J 50/001; H02J 50/005; H02J 50/27; H02J 50/402; H02J 50/70; H01Q 1/248 (86) International application number: PCT/US2022/032772 (87) International publication number: WO 2023/239362 (14.12.2023 Gazette 2023/50)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME Designated Validation States: KH MA MD TN (71) Applicant: National Tsing Hua University Hsinchu (TW)	(72) Inventors: GARU, Prabir Hsinchu (TW) WANG, Fiona Marie Seattle, Washington 98105-6376 (US) WANG, Wei-Chih Sammamish, Washington 98074 (US) (74) Representative: Berggren Oy  P.O. Box 16 Eteläinen Rautatiekatu 10A 00101 Helsinki 00101 Helsinki (FI)