(19)

(11)

EP 4 552 248 A2

(12)

(88) Date of publication A3: 15.02.2024 (43) Date of publication: 14.05.2025 Bulletin 2025/20 (21) Application number: 23738234.6 (22) Date of filing: 31.05.2023

(51) International Patent Classification (IPC):  H04J 13/10(2011.01) H04L 1/00(2006.01) H04J 13/00(2011.01) (52) Cooperative Patent Classification (CPC): H04J 13/107; H04J 13/004; H04J 13/0022; H04L 1/0072; H04L 1/0041; H04L 1/0065; H04L 1/0057 (86) International application number: PCT/US2023/024045 (87) International publication number: WO 2024/010652 (11.01.2024 Gazette 2024/02)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 08.07.2022 US 202263359670 P 23.01.2023 US 202318157991 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: LEI, Jing San Diego, California 92121-1714 (US) YANG, Wei San Diego, California 92121-1714 (US) JIANG, Jing San Diego, California 92121-1714 (US) WU, Yongle San Diego, California 92121-1714 (US) (74) Representative: Tomkins & Co  5 Dartmouth Road Dublin 6, D06 F9C7 Dublin 6, D06 F9C7 (IE)