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EP 4 552 393 A1

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(43) Date of publication: 14.05.2025 Bulletin 2025/20 (21) Application number: 23836287.5 (22) Date of filing: 06.07.2023

(51) International Patent Classification (IPC):  H04W 48/20(2009.01) H04W 48/10(2009.01) H04W 24/08(2009.01) H04W 84/06(2009.01) (52) Cooperative Patent Classification (CPC): H04W 48/20; H04W 84/06; H04W 36/083; H04W 36/0085; H04W 48/16; H04W 52/0245; H04W 52/0258 (86) International application number: PCT/US2023/069732 (87) International publication number: WO 2024/011193 (11.01.2024 Gazette 2024/02)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 07.07.2022 US 202263359116 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054 (US)	(72) Inventors: TANG, Xun Beijing 100085 (CN) MARTINEZ TARRADELL, Marta Hillsboro, Oregon 97124 (US) PALAT, Sudeep Cheltenham Gloucestershire GL51 0GG (GB) LI, Ziyi Beijing 100190 (CN) HAN, Jaemin Portland, Oregon 97229 (US) HEO, Youn Hyoung Seoul Seoul 11 150-705 (KR) (74) Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte  Am Brauhaus 8 01099 Dresden 01099 Dresden (DE)