METHOD OF FORMING AN ELECTRONIC ASSEMBLY HAVING A CONFORMAL COATING, ELECTRONIC ASSEMBLY AND FILM PRECURSOR TO CONFORMAL COATING - Patent 4555833

(19)

(11)

EP 4 555 833 A1

(12)

(43)	Date of publication:
	21.05.2025 Bulletin 2025/21

(21)	Application number: 23764233.5

(22)	Date of filing: 04.08.2023

(51)

International Patent Classification (IPC):

H05K 3/28^(2006.01)

H05K 3/34^(2006.01)

(52)	Cooperative Patent Classification (CPC):
	H05K 2201/09872; H05K 3/284; H05K 3/285; H05K 3/281; H05K 3/3478; H05K 3/3485; H05K 3/3494; H05K 2201/0129

(86)	International application number:
	PCT/EP2023/025367

(87)	International publication number:
	WO 2024/032931 (15.02.2024 Gazette 2024/07)

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
	Designated Extension States:
	BA
	Designated Validation States:
	KH MA MD TN

(30)

Priority:

10.08.2022 GB 202211698

(71)	Applicant: H. K. Wentworth Limited
	Sheerwater Woking, Surrey GU21 5RW (GB)

(72)	Inventor:
	KINNER Phil Surrey GU21 5RW (GB)

(74)	Representative: Boult Wade Tennant LLP
	Salisbury Square House 8 Salisbury Square London EC4Y 8AP London EC4Y 8AP (GB)

(54)	METHOD OF FORMING AN ELECTRONIC ASSEMBLY HAVING A CONFORMAL COATING, ELECTRONIC ASSEMBLY AND FILM PRECURSOR TO CONFORMAL COATING