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EP 4 559 173 A2

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(88) Date of publication A3: 02.05.2024 (43) Date of publication: 28.05.2025 Bulletin 2025/22 (21) Application number: 23855560.1 (22) Date of filing: 20.07.2023

(51) International Patent Classification (IPC):  H04L 67/566(2022.01) H04L 67/60(2022.01) H04L 67/02(2022.01) H04W 88/14(2009.01) (52) Cooperative Patent Classification (CPC): H04L 67/02; H04L 67/565; H04L 67/56 (86) International application number: PCT/US2023/070649 (87) International publication number: WO 2024/039950 (22.02.2024 Gazette 2024/08)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 21.07.2022 US 202263391238 P (71) Applicant: INTEL Corporation Santa Clara, CA 95054-1549 (US)

(72) Inventors: DING, Zongrui Portland, OR 97229 (US) LI, Qian Beaverton, OR 97006 (US) TONG, Xiaopeng Beijing 100090 (CN) STOJANOVSKI, Alexandre, Saso 75020 Paris (FR) LUETZENKIRCHEN, Thomas 82024 Taufkirchen (DE) KOLEKAR, Abhijeet Portland, OR 97229 (US) PALAT, Sudeep Cheltenham Gloucestershire GL51 0GG (GB) BANGOLAE, Sangeetha Portland, OR 97229 (US) HEO, Youn Hyoung Seoul Seoul 11 150-705 (KR) (74) Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte  Am Brauhaus 8 01099 Dresden 01099 Dresden (DE)