(19)
(11) EP 4 562 239 A1

(12)

(43) Date of publication:
04.06.2025 Bulletin 2025/23

(21) Application number: 23847388.8

(22) Date of filing: 28.07.2023
(51) International Patent Classification (IPC): 
D04H 1/70(2012.01)
D04H 1/435(2012.01)
D04H 1/4391(2012.01)
D04H 1/4374(2012.01)
D04H 1/425(2012.01)
(52) Cooperative Patent Classification (CPC):
D04H 1/435; D04H 1/425; D04H 1/4374; D04H 1/70; B32B 5/266; D04H 1/541; D04H 1/407; D04H 1/559; B32B 5/022; B32B 5/20; B32B 5/32; B32B 3/30; B32B 2307/736; B32B 5/08; B32B 2262/144; B32B 2262/0284; B32B 2307/7376; B32B 7/02; B32B 2250/02; B32B 2262/067; B32B 2262/0276; B32B 2307/726; B32B 2555/02; B32B 2432/00
(86) International application number:
PCT/US2023/028968
(87) International publication number:
WO 2024/026088 (01.02.2024 Gazette 2024/05)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 29.07.2022 US 202263393547 P

(71) Applicant: Kimberly-Clark Worldwide, Inc.
Neenah, Wisconsin 54956 (US)

(72) Inventors:
  • MARRANO, Stephen A.
    Neenah, Wisconsin 54956 (US)
  • QIN, Jian
    Neenah, Wisconsin 54956 (US)
  • ABUTO, Francis P.
    Neenah, Wisconsin 54956 (US)
  • LINDSAY, Stephen M.
    Neenah, Wisconsin 54956 (US)
  • ROSACK, Sara L.
    Neenah, Wisconsin 54956 (US)
  • RANGANATHAN, Sridhar
    Neenah, Wisconsin 54956 (US)
  • LABASH, Daniel T.
    Neenah, Wisconsin 54956 (US)
  • DEGRAVE, Greg J.
    Neenah, Wisconsin 54956 (US)
  • NEUBAUER, Andrew E.
    Neenah, Wisconsin 54956 (US)

(74) Representative: Dehns 
10 Old Bailey
London EC4M 7NG
London EC4M 7NG (GB)

   


(54) METHOD FOR FORMING MULTILAYER NONWOVEN MATERIALS WITH TOPOGRAPHIC PROJECTIONS VIA DIFFERENTIAL SHRINKAGE