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EP 4 562 680 A1

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(43) Date of publication: 04.06.2025 Bulletin 2025/23 (21) Application number: 24719858.3 (22) Date of filing: 28.03.2024

(51) International Patent Classification (IPC):  H01L 23/367(2006.01) H01L 23/473(2006.01) H01L 25/07(2006.01) H01L 23/373(2006.01) H01L 23/498(2006.01) (52) Cooperative Patent Classification (CPC): H01L 23/3735; H01L 23/49811; H01L 23/3677; H01L 23/473; H01L 25/072 (86) International application number: PCT/US2024/022102 (87) International publication number: WO 2024/206725 (03.10.2024 Gazette 2024/40)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: GE KH MA MD TN (30) Priority: 30.03.2023 US 202363455822 P 26.03.2024 US 202418617325 (71) Applicant: Semiconductor Components Industries, LLC Scottsdale, AZ 85250 (US)	(72) Inventors: PRAJUCKAMOL, Atapol Thanyaburi, Pathumthani, 12130 (TH) CHEW, Chee Hiong Seremban, 70300 (MY) (74) Representative: Manitz Finsterwald Patent- und Rechtsanwaltspartnerschaft mbB  Martin-Greif-Strasse 1 80336 München 80336 München (DE)