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EP 4 566 192 A1

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(43) Date of publication: 11.06.2025 Bulletin 2025/24 (21) Application number: 23761716.2 (22) Date of filing: 02.08.2023

(51) International Patent Classification (IPC):  H04B 7/06(2006.01) H04L 5/00(2006.01) H04B 7/08(2006.01) H04W 56/00(2009.01) (52) Cooperative Patent Classification (CPC): H04B 7/0695; H04B 7/088; H04L 5/0053; H04W 56/0015; H04L 5/0023; H04L 5/0094 (86) International application number: PCT/US2023/071527 (87) International publication number: WO 2024/030964 (08.02.2024 Gazette 2024/06)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 03.08.2022 US 202263370302 P 01.08.2023 US 202318363410 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: LEI, Jing San Diego, California 92121-1714 (US) JIANG, Jing San Diego, California 92121-1714 (US) WU, Yongle San Diego, California 92121-1714 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)