(19)

(11)

EP 4 566 396 A1

(12)

(43) Date of publication: 11.06.2025 Bulletin 2025/24 (21) Application number: 23761309.6 (22) Date of filing: 02.08.2023

(51) International Patent Classification (IPC):  H04W 72/23(2023.01) H04W 52/02(2009.01) H04W 76/28(2018.01) (52) Cooperative Patent Classification (CPC): H04W 76/28; H04W 72/23; H04W 52/0229 (86) International application number: PCT/US2023/029353 (87) International publication number: WO 2024/030518 (08.02.2024 Gazette 2024/06)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 03.08.2022 US 202263370367 P 01.08.2023 US 202318363615 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: XU, Huilin San Diego, California 92121 (US) NAM, Wooseok San Diego, California 92121 (US) MAAMARI, Diana San Diego, California 92121 (US) SAKHNINI, Iyab Issam San Diego, California 92121 (US) ELSHAFIE, Ahmed San Diego, California 92121 (US) (74) Representative: Tomkins & Co  5 Dartmouth Road Dublin 6, D06 F9C7 Dublin 6, D06 F9C7 (IE)