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(11)

EP 4 569 798 A1

(12)

(43) Date of publication: 18.06.2025 Bulletin 2025/25 (21) Application number: 23768031.9 (22) Date of filing: 11.08.2023

(51) International Patent Classification (IPC):  H04L 67/02(2022.01) H04L 65/1069(2022.01) (52) Cooperative Patent Classification (CPC): H04L 65/1069; H04L 67/02; H04L 65/1108; H04L 65/1063; H04L 65/1045; H04L 69/24; H04L 65/1104; H04L 69/14; H04L 67/141 (86) International application number: PCT/US2023/030036 (87) International publication number: WO 2024/035907 (15.02.2024 Gazette 2024/07)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 11.08.2022 US 202263371146 P 10.08.2023 US 202318447633 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: BOUAZIZI, Imed San Diego, California 92121-1714 (US) PAZOS, Carlos Marcelo Dias San Diego, California 92121-1714 (US) MA, Liangping San Diego, California 92121-1714 (US) HE, Yong San Diego, California 92121-1714 (US) (74) Representative: Reddie & Grose LLP  The White Chapel Building 10 Whitechapel High Street London E1 8QS London E1 8QS (GB)