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(11)

EP 4 569 859 A1

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(43) Date of publication: 18.06.2025 Bulletin 2025/25 (21) Application number: 23769040.9 (22) Date of filing: 09.08.2023

(51) International Patent Classification (IPC):  H04W 24/02(2009.01) G06N 20/00(2019.01) H04B 7/06(2006.01) G01S 5/00(2006.01) G06N 3/00(2023.01) H04L 41/16(2022.01) H04W 64/00(2009.01) (52) Cooperative Patent Classification (CPC): H04W 24/02; H04B 7/0626; H04B 7/0695; H04B 17/3913; H04W 64/00; G06N 3/09; G06N 3/084; G06N 3/098; H04L 41/147 (86) International application number: PCT/US2023/071926 (87) International publication number: WO 2024/036208 (15.02.2024 Gazette 2024/07)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 11.08.2022 US 202263371205 P 08.08.2023 US 202318446320 (71) Applicant: QUALCOMM Incorporated San Diego, CA 92121-1714 (US)	(72) Inventors: PEZESHKI, Hamed San Diego, California 92121 (US) YOO, Taesang San Diego, California 92121 (US) LUO, Tao San Diego, California 92121 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)