(19)
(11) EP 4 573 593 A1

(12)

(43) Date of publication:
25.06.2025 Bulletin 2025/26

(21) Application number: 23768753.8

(22) Date of filing: 17.08.2023
(51) International Patent Classification (IPC): 
H01L 21/768(2006.01)
H01L 23/532(2006.01)
H01L 23/522(2006.01)
(52) Cooperative Patent Classification (CPC):
H01L 23/53276; H01L 23/53238; H01L 21/76873; H01L 21/76846; H01L 21/76864; H01L 21/76807; H01L 23/5226
(86) International application number:
PCT/US2023/072431
(87) International publication number:
WO 2024/040200 (22.02.2024 Gazette 2024/08)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 19.08.2022 US 202263399551 P

(71) Applicant: Avient Corporation
Avon Lake, Ohio 44012 (US)

(72) Inventors:
  • PURAYATH, Vinod
    Avon Lake, Ohio 44012 (US)
  • ZHOU, Jian
    Avon Lake, Ohio 44012 (US)
  • OHAMA, Kenta
    Avon Lake, Ohio 44012 (US)

(74) Representative: Appleyard Lees IP LLP 
15 Clare Road
Halifax HX1 2HY
Halifax HX1 2HY (GB)

   


(54) METHOD OF FORMING INTERCONNECT STRUCTURES