(19)
(11) EP 4 573 594 A1

(12)

(43) Date of publication:
25.06.2025 Bulletin 2025/26

(21) Application number: 22768301.8

(22) Date of filing: 18.08.2022
(51) International Patent Classification (IPC): 
H01L 23/16(2006.01)
 H01L 23/31(2006.01)
(52) Cooperative Patent Classification (CPC):
H01L 23/3107; H01L 23/16; H01L 23/562
(86) International application number:
PCT/EP2022/073049
(87) International publication number:
WO 2024/037720 (22.02.2024 Gazette 2024/08)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(71) Applicant: Hitachi Energy Ltd
8050 Zürich (CH)

(72) Inventors:
  • TRUESSEL, Dominik
    5620 Bremgarten (CH)
  • MALEKI, Milad
    5417 Untersiggenthal (CH)
  • SANTOLARIA, Lluis
    4600 Olten (CH)

(74) Representative: Epping - Hermann - Fischer 
Patentanwaltsgesellschaft mbH Schloßschmidstraße 5
80639 München
80639 München (DE)

   


(54) SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR POWER MODULE