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(11)

EP 4 573 669 A1

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(43) Date of publication: 25.06.2025 Bulletin 2025/26 (21) Application number: 23765117.9 (22) Date of filing: 14.08.2023

(51) International Patent Classification (IPC):  H04B 7/024(2017.01) H04B 7/08(2006.01) H04B 7/0408(2017.01) (52) Cooperative Patent Classification (CPC): H04B 7/024; H04B 7/0834; H04B 7/0408; H04L 27/2607; H04L 5/001 (86) International application number: PCT/US2023/072167 (87) International publication number: WO 2024/040026 (22.02.2024 Gazette 2024/08)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 15.08.2022 US 202263398214 P 11.08.2023 US 202318448767 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: GHEORGHIU, Valentin Alexandru San Diego, California 92121-1714 (US) TAKEDA, Kazuki San Diego, California 92121-1714 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)