(19)

(11)

EP 4 578 045 A1

(12)

(43) Date of publication: 02.07.2025 Bulletin 2025/27 (21) Application number: 23754091.9 (22) Date of filing: 21.07.2023

(51) International Patent Classification (IPC):  H01L 23/522(2006.01) H01L 23/00(2006.01) H01L 23/64(2006.01) (52) Cooperative Patent Classification (CPC): H01L 23/5227; H01L 23/645; H01L 23/49822; H01L 25/16; H01L 23/49816; H10D 1/20 (86) International application number: PCT/US2023/070720 (87) International publication number: WO 2024/044438 (29.02.2024 Gazette 2024/09)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 25.08.2022 US 202263400971 P 22.02.2023 US 202318172975 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: TSENG, Anshih San Diego, California 92121 (US) ZOU, Peng San Diego, California 92121 (US) (74) Representative: Klang, Alexander H.  Wagner & Geyer Partnerschaft mbB Patent- und Rechtsanwälte Gewürzmühlstrasse 5 80538 München 80538 München (DE)