(19)

(11)

EP 4 578 213 A1

(12)

(43) Date of publication: 02.07.2025 Bulletin 2025/27 (21) Application number: 23757450.4 (22) Date of filing: 21.07.2023

(51) International Patent Classification (IPC):  H04W 24/02(2009.01) H04W 88/08(2009.01) (52) Cooperative Patent Classification (CPC): H04W 24/02; H04W 88/085 (86) International application number: PCT/US2023/070744 (87) International publication number: WO 2024/044440 (29.02.2024 Gazette 2024/09)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 25.08.2022 US 202263373544 P 20.07.2023 US 202318356130 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: GARYANTES, Michael Francis San Diego, California 92121-1714 (US) SACHIDANAND SINHA, Abhishek Saurabh San Diego, California 92121-1714 (US) KUPPUSWAMY, Kalyan San Diego, California 92121-1714 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)