(19)
(11) EP 4 581 082 A1

(12)

(43) Date of publication:
09.07.2025 Bulletin 2025/28

(21) Application number: 23801645.5

(22) Date of filing: 17.10.2023
(51) International Patent Classification (IPC): 
C08L 71/02(2006.01)
C08G 65/336(2006.01)
C08K 3/22(2006.01)
(52) Cooperative Patent Classification (CPC):
C08G 65/336; C08L 71/02; C08K 2003/2227; C08K 2003/2296; C08K 2201/014
 
C-Sets:
C08L 71/02, C08L 71/02, C08K 5/5419, C08K 5/544, C08K 3/22;
(86) International application number:
PCT/US2023/077055
(87) International publication number:
WO 2024/086553 (25.04.2024 Gazette 2024/17)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 18.10.2022 US 202263417123 P

(71) Applicant: Dow Silicones Corporation
Midland, MI 48686-0994 (US)

(72) Inventors:
  • BECERRA, AndrĂ©s, E.
    Auburn, MI 48611 (US)
  • ZHU, Bizhong
    Midland, MI 48686-0994 (US)
  • ALTERGOTT, David, M.
    Midland, MI 48611 (US)

(74) Representative: Elkington and Fife LLP 
Prospect House 8 Pembroke Road
Sevenoaks, Kent TN13 1XR
Sevenoaks, Kent TN13 1XR (GB)

   


(54) SILANE MODIFIED POLYMER-BASED THERMALLY CONDUCTIVE COMPOSITION