PLATING SOLUTION DISPERSION METHOD

Abstract

 The present invention provides a plating solution dispersion method, relating to the technical field of electroplating. The plating solution dispersion method includes: intermittently inputting bubbles into a plating solution in the case of electroplating, and intermittently performing an ultrasonic treatment on the plating solution in the process of intermittently inputting the bubbles, wherein at least some of the bubbles are within an ultrasound influence range. The plating solution dispersion method provided by the present invention can not only promote the uniform dispersion of the plating solution, but also ensure the stability of the plating solution during an electroplating process.

Description

TECHNICAL FIELD

[0001] The present invention relates to the technical field of electroplating, in particular to a plating solution dispersion method.

BACKGROUND

[0002] Under the existing technologies, in order to improve the thermal conductivity, electrical conductivity, wear resistance and other performances of a plating layer, graphene and other substances may be added to a plating solution during an electroplating process to form a composite plating layer to meet performance requirements of the plating layer. However, solid particles such as graphene are prone to agglomeration and formation of graphite during the electroplating process, and at this time, the graphite will be electroplated to the surface of the plating layer instead of graphene, which will have an adverse effect on electroplating. Therefore, in the existing technologies, a method of adding a dispersant to the plating solution is generally used to prevent the aggregation of solid particles such as graphene into large particles. Although the addition of the dispersant alleviates the agglomeration of solid particles such as graphene in the plating solution to a certain extent, it is difficult for traditional dispersants to promote the migration and diffusion of solid particles such as graphene in the plating solution, so the performance of a composite plating layer prepared by adding the dispersant hardly achieves an expected effect. In addition, although mechanical agitation and ultrasonic dispersion can also promote the dispersion of solid particles such as graphene, in the electroplating process, it is necessary to keep the plating solution stable, while the traditional mechanical agitation and simple ultrasonic dispersion will increase the flow and oscillation of the plating solution, which will have an adverse effect on the plating layer, so it is difficult to apply the traditional mechanical agitation of a plating solution and simple ultrasonic dispersion to the electroplating process.

[0003] In summary, how to promote the uniform dispersion of graphene and other solid particles in the plating solution while ensuring the stability of the plating solution is an urgent problem for the existing technologies to be improved.

SUMMARY

[0004] An object of the present invention is to provide a plating solution dispersion method. The plating solution dispersion method can promote the uniform dispersion of graphene in a plating solution and ensure the stability of the plating solution in the electroplating process.

[0005] In order to solve the above problems, the technical scheme of the present invention is as follows:
the present invention provides a plating solution dispersion method, comprising:
intermittently inputting bubbles into a plating solution in the case of electroplating, and intermittently performing an ultrasonic treatment on the plating solution in the process of intermittently inputting the bubbles, wherein at least some of the bubbles are within an ultrasound influence range.

[0006] Optionally, in some embodiments of the present invention, the ultrasonic treatment is performed once in the process of a single bubble input.

[0007] Optionally, in some embodiments of the present invention, a duration of the single bubble input is 0.1 to 6 min, and a duration of a single ultrasonic treatment is 1 to 6 min.

[0008] Optionally, in some embodiments of the present invention, the intermittent time between the bubble inputs is 5 to 20 min; and the intermittent time between the ultrasonic treatments is 1 to 20 min.

[0009] Optionally, in some embodiments of the present invention, in the process of the single bubble input, the ultrasonic treatment is performed 10 to 50 s after an initial bubble input.

[0010] Optionally, in some embodiments of the present invention, the plating solution comprises solid particles, and a material of the solid particles is selected from one or more of graphene, a metal oxide, and a non-metallic oxide.

[0011] Optionally, in some embodiments of the present invention, each bubble has a diameter of 0.01 to 1000 µm; or

the bubble has a diameter of 1 to 150 µm; or

the bubble has a diameter of 30 to 80 µm.

[0012] Optionally, in some embodiments of the present invention, an ultrasonic frequency of the ultrasonic treatment is 40 to 50 kHz.

[0013] Optionally, in some embodiments of the present invention, the input of the bubbles into the plating solution is implemented through a bubble input port, the plating solution is contained with a container, and a cathode and an anode which are spaced from each other are accommodated in the container;

the bubble input port is arranged between the cathode and the anode, and the bubble input port is close to the anode and away from the cathode; or

the cathode is located on one side of the anode away from a side wall of the container, the bubble input port is arranged between the anode and the side wall, and the bubble input port is close to the side wall and away from the anode.

[0014] Optionally, in some embodiments of the present invention, the bubble input port is oriented to a direction where the cathode is located.

[0015] Optionally, in some embodiments of the present invention, a plurality of bubble input ports is provided, and each bubble input port has a position height difference in a vertical direction.

[0016] Optionally, in some embodiments of the present invention, two bubble input ports are provided; and the two bubble input ports are located in a first region and a second region respectively, wherein the first region is a region between a horizontal plane where a middle part of the cathode is located and a horizontal plane where a lower part of the cathode is located, and the second region is a region between the horizontal plane where the lower part of the cathode is located and a horizontal plane where the bottom of the container is located.

[0017] Optionally, in some embodiments of the present invention, the bubble input port located in the first region is a first input port; the bubble input port located in the second region is a second input port; the first input port is oriented to a part above a horizontal plane where the first input port is located; and the second input port is oriented to a part below a horizontal plane where the second input port is located.

[0018] Optionally, in some embodiments of the present invention, an included angle between an axis where the first input port is located and a horizontal plane is 30° to 80°; and an included angle between an axis where the second input port is located and the horizontal plane is 30° to 80°.

[0019] Optionally, in some embodiments of the present invention, the ultrasonic treatment is implemented by an ultrasonic device, and the ultrasonic device is located in the first region.

[0020] Optionally, in some embodiments of the present invention, the ultrasonic device is located between the bubble input port and the cathode; and the ultrasonic device is close to the bubble input port and away from the cathode.

[0021] Optionally, in some embodiments of the present invention, when the bubbles are input, a total amount of gas input per minute is 10 to 80 L.

[0022] Optionally, in some embodiments of the present invention, when the bubbles are input, the input gas is selected from one or more of hydrogen, nitrogen, or air.

[0023] Compared with the prior art, the present invention includes the following beneficial effects.

[0024] In the present invention, the bubbles are input into the plating solution intermittently in the electroplating process and the ultrasonic treatment is performed intermittently on the plating solution. In this way, on one hand, the bubbles will intensify the diffusion growth under the action of ultrasonic waves and rupture after the bubbles grow to a rupture limit, and an instantaneous propulsive force may be produced locally at the moment of bubble rupture. The plating solution is locally subjected to micro-agitation, and then a local microcirculation is formed to the plating solution, thereby promoting the uniform dispersion of the plating solution. On the other hand, the diffusion movement of the bubbles in the plating solution will also produce micro-agitation on the plating solution, which will play a role in dispersing the plating solution. In addition, because the bubble input and the ultrasonic treatment are both performed intermittently, the present invention can ensure the relative stability of the plating solution in the electroplating process by controlling the bubble input and the ultrasonic treatment.

[0025] The plating solution dispersion method provided by the present invention is especially suitable for the plating solution containing solid particles such as graphene. This dispersion method can play a role in fully dispersing solid particles such as graphene, and effectively avoid the aggregation of solid particles such as graphene into large particles, thereby improving the electroplating quality.

[0026] In summary, compared with the prior art, the plating solution dispersion method provided by the present invention can promote the uniform dispersion of the plating solution, especially the dispersion of solid particles such as graphene in the plating solution, and also ensure the stability of the electroplating solution.

BRIEF DESCRIPTION OF THE DRAWINGS

[0027] To describe the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings required for describing the embodiments. Apparently, the accompanying drawings in the following description show merely some embodiments of the present invention, and a person of ordinary skill in the art may still derive other drawings from these accompanying drawings without creative efforts.
FIG. 1 is a schematic diagram of a plating solution situation provided in Embodiment 1 of the present invention.

[0028] The reference numerals are summarized as follows:
101-electroplating bath; 102-bubble input port; 103-ultrasonic device; 104-anode; 105-cathode; 106-first region; and 107-second region.

DETAILED DESCRIPTION OF THE INVENTION

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described as follows in combination with the drawings in the examples of the present invention, but obviously, the described examples are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the examples of the present invention, all other examples obtained by a person skilled in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] The technical solution provided by the present invention will be described in detail below. It should be noted that the description order of the following embodiments is not intended to limit the priority order of the embodiments. In addition, in the description of the present invention, the term "including" means "including but not limited to". The terms "first", "second", etc., are used only as indications and do not impose numerical requirements or establish sequences. Various embodiments of the present invention may exist in the form of a scope. It should be understood that the description in the form of a scope is only for convenience and conciseness, and should not be construed as a rigid limitation on the scope of the present invention. Therefore, the scope description should be considered to have specifically disclosed all possible sub-scopes as well as a single value within this scope.

[0031] The present invention provides a plating solution dispersion method, which includes:
intermittently inputting bubbles into a plating solution in the case of electroplating, and intermittently performing an ultrasonic treatment on the plating solution in the process of inputting the bubbles, wherein at least some of the bubbles are within an ultrasound influence range.

[0032] By taking the intermittent input of the bubbles into the plating solution as an example, "intermittent" here refers to a periodic repetition of the operations of performing a bubble input and stopping the bubble input, and a duration of stopping the bubble input is the intermittent time of the bubble input. More particularly, the intermittent time between the bubble inputs refers to a duration between a moment at the end of one bubble input operation and a moment at the start of the next adjacent bubble input operation. Concepts such as "intermittent" and "intermittent time" in the ultrasonic treatment are similar to the above explanations and will not be repeated here.

[0033] It may be understood that "at least some of the bubbles are within the ultrasound influence range" means that at least some of the bubbles input into the plating solution can rupture under the action of ultrasounds and create a micro-agitation effect on the local plating solution.

[0034] The plating solution dispersion method provided by the present invention can promote the uniform dispersion of the plating solution while ensuring the stability of the electroplating solution.

[0035] It should be noted that intermittent ultrasonic treatment of the plating solution in the process of inputting bubbles means that the ultrasonic treatment is performed intermittently in conjunction with the bubble input, so that the bubble input and the ultrasonic treatment are performed at the same time. Further, the ultrasonic treatment may be performed during each bubble input, or during a part of single bubble input, as long as the dispersion of the plating solution can be satisfied.

[0036] Preferably, a single ultrasonic treatment is performed in the process of a single bubble input, thereby further improving a dispersion effect of solid particles such as graphene in the plating solution.

[0037] Optionally, in some embodiments of the present invention, a duration of a single bubble input may be 0.1 to 6 min, and a duration of a single ultrasonic treatment may be 1 to 6 min.

[0038] In some embodiments, the intermittent time between bubble inputs may be 5 to 20 min; and the intermittent time between the ultrasonic treatments may be 1 to 20 min.

[0039] When the duration of a single bubble input, the duration of a single ultrasonic treatment, the intermittent duration between the bubble inputs and the intermittent duration between the ultrasonic treatments are within the above ranges, the stability of the plating solution can be well maintained, which is conducive to electroplating.

[0040] Further, in the process of setting and adjusting the durations and intermittent durations of the bubble input and ultrasonic treatment, it is necessary to allow a situation that the bubble input and the ultrasonic treatment are performed at the same time in the operation process of each bubble input, so that each bubble input can start at the same time as the ultrasonic treatment, or the bubbles can be input first each time and the ultrasonic treatment is performed before the operation of the single bubble input ends. Further, each time the bubbles are input and subjected to ultrasonic treatment, the bubble input operation may end at the same time as the ultrasonic treatment operation, or the bubble input operation may end before the ultrasonic treatment operation, or the ultrasonic treatment operation may precede the end of the bubble input operation.

[0041] Preferably, the bubbles may be input first each time, the ultrasonic treatment may be performed before the end of the single bubble input operation, and the operation of the bubble input precedes the end of the ultrasonic treatment operation.

[0042] In some embodiments, in the process of a single bubble input, the ultrasonic treatment may start 10 to 50 s after the initial bubble input. That is, in the process of each bubble input and ultrasonic treatment, the bubble input operation can be performed first, and then the ultrasonic treatment operation can start after the bubble input operation lasts for 10 to 50 s, so that the bubble input and the ultrasonic operation are performed at the same time. It may be understood that in this case, the bubble input operation should not be finished at the beginning of the ultrasonic treatment in order to ensure that the bubble input and the ultrasound operation can be performed at the same time.

[0043] In some embodiments, the plating solution includes solid particles which are selected from one or more of graphene, a metal oxide, and a non-metal oxide.

[0044] The plating solution method provided by the present invention is particularly suitable for a plating solution including solid particles such as graphene. The plating solution dispersion method provided by the present invention can effectively prevent the solid particles (graphene, zinc oxide, silica, etc.) in the plating solution from aggregating into large particles, so that the related electroplating process can be performed smoothly.

[0045] Preferably, the plating solution dispersion method provided by the present invention is suitable for a plating solution including graphene. The plating solution dispersion method provided by the present invention can effectively prevent the agglomeration of graphene in the plating solution.

[0046] In some embodiments, each bubble may have a diameter of 0.01 to 1000 µm; preferably, the bubble may have a diameter of 1 to 150 µm; and more preferably, the bubble may have a diameter of 30 to 80 µm. When the diameter of the bubble is within the above range, the stability of the plating solution can be ensured.

[0047] In some embodiments, an ultrasonic frequency of the ultrasonic treatment is 40 to 50 kHz.

[0048] In some embodiments, the input of the bubbles into the plating solution is implemented through a bubble input port, the plating solution is contained with a container, a cathode and an anode which are spaced from each other are accommodated in the container, the bubble input port may be arranged between the cathode and the anode, and the bubble input port is close to the anode and away from the cathode.

[0049] It should be noted that in order to ensure that the bubbles can rupture under the action of ultrasounds and produce local micro-agitation of the plating solution, the setting of the bubble input port still needs to meet the prerequisite that at least some of the bubbles are within the ultrasound influence range. When the bubble input port is arranged between the cathode and the anode, the bubbles can rupture between the cathode and the anode, and the plating solution between the cathode and the anode is subjected to targeted micro-agitation, so that the diffusion and migration of substances in the plating solution between the cathode and the anode can be enhanced, substances (including cations, solid particles, etc.) consumed by electroplating near the cathode can be supplemented, and the concentration of related substances in the plating solution near the cathode can be kept stable. Taking the plating solution including graphene and other solid particles as an example, the bubble input port is arranged between the cathode and the anode, which can enhance the diffusion and migration of the graphene between the anode and the cathode, promote the migration of graphene to the surface of the cathode, and ensure that the concentration of the graphene on the surface is maintained at a certain level.

[0050] Further, the cathode may be located on one side of the anode away from the side wall of the container, the bubble input port may be arranged between the anode and the side wall, and the bubble input port may be close to the side wall and away from the anode. In this way, the disturbance of large bubbles to the plating solution near the cathode can be reduced, and the electroplating quality can be improved. For example, in some embodiments, by arranging the bubble input port on one side of the anode away from the cathode, a distance away from the cathode surface is still greater than 5 cm when the bubbles rupture.

[0051] In some embodiments, the container containing the plating solution may be an electroplating bath.

[0052] In some embodiments, the bubble input port may be oriented to a direction where the cathode is located. When the bubble input port is oriented to the direction where the cathode is located, it is more conducive to the migration of the substances in the plating solution to the cathode, so that the concentration of the plating solution near the cathode remains relatively stable.

[0053] In some embodiments, a plurality of bubble input ports is provided, and each bubble input port has a position height difference in a vertical direction.

[0054] When the plating solution dispersion method provided by the present invention includes a plurality of bubble input ports with height difference in a vertical direction, under the action of ultrasounds, the bubbles input into the plating solution can ruptures at different depths of the plating solution, so that the plating solution at different depths is locally micro-agitated, thereby promoting the dispersion of the plating solution at different depths. Further, two bubble input ports may be provided. The number of bubble input ports may be three, four, or five. Preferably, the number of the bubble input ports may be two.

[0055] In some embodiments, two bubble input ports are provided; and the two bubble input ports are located in a first region and a second region respectively, wherein the first region is a region between a horizontal plane where a middle part of the cathode is located and a horizontal plane where a lower part of the cathode is located, and the second region is a region between the horizontal plane where the lower part of the cathode is located and a horizontal plane where the bottom of the container is located. The first region may be understood as a middle-lower region of the plating solution, and the second region may be understood as a bottom region of the plating solution. It may be understood that the first region is located above the second region, the plating solution is still above the first region, and part of the cathode is located in the plating solution above the first region. In some embodiments, a region between the horizontal plane where the middle part of the cathode is located and the horizontal plane where an upper part of the cathode is located may be referred to as a third region, and the third region may be understood as the middle-upper region of the plating solution.

[0056] When the two bubble input ports are located in the first region and the second region respectively, bubbles input to the plating solution through the bubble input port located in the second region will first micro-agitate the plating solution in the bottom region of the plating solution through bubble flowing; and then under the action of buoyancy, bubbles input to the plating solution through the bubble input port located in the second region will move upward to the first region and rupture under the action of ultrasounds, and produce local micro-agitation of the plating solution between the cathode and anode in the first region, thereby improving the local microcirculation of the plating solution between the cathode and the anode in the first region. Therefore, the bubbles input to the plating solution through the bubble input port located in the second region may focus on microcirculation agitation for the plating solution in the first region and the second region. However, the bubbles input to the plating solution through the bubble input port in the first region may also move upward under the action of buoyancy. When the bubbles are input to the plating solution through the bubble input port located in the first region moving upward to the third region, the bubbles moving to the third region may also rupture under the action of ultrasounds, so as to focus on local micro-agitation for the plating solution in the third region. In addition, when the bubbles input to the plating solution through the bubble input port in the second region may rupture near the bubble input port located in the first region to form small bubbles, the formed small bubbles may be fused with the bubbles input to the plating solution through the bubble input port located in the first region and become a part of the bubbles input to the plating solution through the bubble input port located in the first region, and then rupture again to enhance the local microcirculation agitation for the plating solution.

[0057] Therefore, when the two bubble input ports are located in the first region and the second region respectively, it is possible to perform local micro-agitation on the plating solution at the bottom, middle-lower part and the middle-upper part of each region at the same time, and disperse the plating solution at the bottom, the middle-lower part and the middle-upper part.

[0058] In some embodiments, the two bubble input ports may be located on the same vertical axis in a vertical direction. The axis here does not refer to a direction of an axis oriented by the bubble input port, but to a vertical axis in the vertical direction.

[0059] In some embodiments, the bubble input port located in the first region is a first input port, the bubble input port located in the second region is a second input port, the first input port is oriented to a part above a horizontal plane where the first input port is located, and the second input port is oriented to a part below a horizontal plane where the second input port is located.

[0060] When the second input port is oriented to the part below its horizontal direction, the bubbles input to the plating solution through the second input port may first move downward for a certain distance before moving upward under the action of buoyancy, so that a part of the bubbles input to the plating solution through the second input port may rupture in the second region, thereby providing local circulation micro-agitation on the plating solution in the second region.

[0061] In some embodiments, an included angle between an axis where the bubble input port located in the first region is located and a horizontal plane may be 30° to 80°; and an included angle between an axis where the bubble input port located in the second region is located and the horizontal plane may be 30° to 80°. It may be understood that the axis where the bubble input port is located refers to a central axis of the bubble input port.

[0062] Preferably, the included angle between the axis where the bubble input port located in the first region is located and the horizontal plane may be 30° to 60°; and the included angle between the axis where the bubble input port located in the second region is located and the horizontal plane may be 30° to 60°.

[0063] In some embodiments, the ultrasonic treatment may be implemented by means of an ultrasonic device, which may be located in the first region. Since the first region is provided with the bubble input port, when the ultrasound device is located in the first region, it can be ensured that at least some of the bubbles are within the ultrasound influence range.

[0064] In some embodiments, the ultrasonic device may be located between the bubble input port and the cathode, and the ultrasonic device may be close to the bubble input port and away from the cathode.

[0065] When the ultrasonic device is located between the bubble input port and the cathode, and the ultrasonic device is close to the bubble input port and away from the cathode, the ultrasonic device is located near the bubble input port, so that more bubbles can be guaranteed to be within the ultrasound influence range, and then a local micro-agitation effect on the plating solution during bubble rupture can be ensured. In addition, the ultrasonic device is arranged away from the cathode, so that the disturbance of ultrasounds to the plating solution near the cathode can be reduced, and the relative stability of the plating solution near the cathode can be ensured, so as to ensure the electroplating quality.

[0066] Further, when the plating solution dispersion method involves a plurality of bubble input ports, the ultrasonic device may be located between the bubble input port and the cathode.

[0067] In some embodiments, a distance between the ultrasonic device and the cathode may be at least 40 cm.

[0068] In some embodiments, when bubbles are input, a total amount of gas input per minute may be 10 to 80 L.

[0069] The total amount of gas input per minute is a volume of gas actually input into the plating solution per minute against a plating solution pressure. When the total amount of gas input per minute is within the above range, the sizes of the bubbles can be controlled, such that the number of the bubbles in the plating solution, a rupture frequency and a flow rate are all within the optimal ranges, achieving appropriate micro-agitation strength of the bubbles for the plating solution.

[0070] Further, the diameters and input amount of the bubbles may be determined according to the depth of the bubble input port in the plating solution and the content of solid particles such as graphene in the plating solution. For example, the deeper the depth of the bubble input port in the plating solution, the larger the input amount of the bubbles can be set, and the smaller the diameters of the bubbles can be set. For example, at the same depth of the plating solution, the greater the concentration of solid particles such as graphene in the plating solution, the larger the input amount of bubbles can be set, and the smaller the diameters of the bubbles can be set.

[0071] Further, when two bubble input ports are provided, and the two bubble input ports are located in the first and second regions respectively, the amounts of gas input to the plating solution per minute through the two bubble input ports may be the same or different. More specifically, the amount of gas input to the plating solution per minute through the bubble input port located in the second region may be more than the amount of gas input to the plating solution per minute through the bubble input port located in the first region.

[0072] In some embodiments, when the bubbles are input, the input gas may be selected from one or more of hydrogen, nitrogen, or air.

[0073] In the present invention, different gases may be selected according to the difference of plating layers to produce different additional effects. For example, when a copper plating layer is electroplated, air may be input, which can promote the smooth electroplating of the copper plating layer. When a silver plating layer is electroplated, hydrogen may be input. The surface of the silver plating layer is more uniform and bright by means of a reduction characteristic of the hydrogen.

[0074] In some embodiments, the input gas may be a mixture of gases, such as nitrogen and hydrogen, which is not limited here.

Embodiment 1

[0075] The present embodiment provides a plating solution dispersion method of a graphene-silver plating solution. A schematic diagram of a plating solution situation is shown in FIG. 1. The method includes:
electroplating in an electroplating bath 101 by using a graphene-silver plating solution. An opening size of the electroplating bath 101 is 2m×2m, a vertical depth of the plating solution is 1.2 m, and a concentration of graphene in the plating solution is 10 g/L. During electroplating, hydrogen is intermittently input to the plating solution, a duration of a single hydrogen input is 4 min, the diameter of the input bubble is 20 µm, the intermittent time between the bubble inputs is 10 min, the graphene-silver plating solution is subjected to ultrasonic treatment after 6 s of an initial bubble input, a duration of a single ultrasonic treatment is 5 min, and the intermittent time of the ultrasonic treatment is 8 min.

[0076] The bubbles are input through two bubble input ports 102. The two bubble input ports 102 are located between an anode 104 and a cathode 105 and are oriented to the cathode 105. The two bubble input ports 102 are respectively located in a first region 106 and a second region 107 of the plating solution. The two bubble input ports 102 are located on the same vertical axis in a vertical direction. A distance between the bubble input port 102 located in the first region 106 and the bottom of the electroplating bath 101 is 0.3 m. The bubble input port 102 located in the first region 106 is oriented to a direction above a horizontal direction where the bubble input port 102 is located. An included angle between an axis of the bubble input port 102 located in the first region 106 and a horizontal plane is 45°. An amount of gas input per minute through the bubble input port 102 located in the first region 106 is 20 L. A distance between the bubble input port 102 located in the second region 107 and the bottom of the electroplating bath 101 is 0.1 m. The bubble input port 102 located in the second region 107 is oriented to a direction below a horizontal direction where the bubble input port 102 is located. An included angle between an axis of the bubble input port 102 located in the second region 107 is located and the horizontal plane is 45°. An amount of gas input per minute through the bubble input port 102 located in the second region 107 is 20 L. A distance between the bubble input port 102 and the cathode 105 in a horizontal direction is 0.75 m.

[0077] The ultrasonic treatment is performed by an ultrasonic device 103. The ultrasonic device 103 is located between the bubble input port 102 and the cathode 105. A distance between the ultrasonic device 103 and the cathode 105 in a horizontal direction is 0.5 m, and an ultrasonic frequency is 42 kHz.

Embodiment 2

[0078] The present embodiment provides a plating solution dispersion method of a graphene-silver plating solution. The method includes:
electroplating in an electroplating bath by using a graphene-silver plating solution. An opening size of the electroplating bath is 2m×2m, a vertical depth of the plating solution is 1.5 m, and a concentration of graphene in the plating solution is 10 g/L. During electroplating, hydrogen is intermittently input to the plating solution, a duration of a single hydrogen input is 0.1 min, the diameter of the input bubble is 0.01 µm, the intermittent time between the bubble inputs is 5 min, the graphene-silver plating solution is subjected to ultrasonic treatment at the same time as an initial bubble input, the duration of a single ultrasonic treatment is 1 min, and the intermittent time between the ultrasonic treatments is 4.1 min.

[0079] The bubbles are input through two bubble input ports. The two bubble input ports are located on one side of an anode away from a cathode and is oriented towards the cathode. The two bubble input ports are respectively located in a first region and a second region of the plating solution. The two bubble input ports are located on the same vertical axis in a vertical direction. A distance between the bubble input port located in the first region and the bottom of the electroplating bath is 0.4 m. The bubble input port located in the first region is oriented to a direction above a horizontal direction where the bubble input port is located. An included angle between an axis of the bubble input port located in the first region and a horizontal plane is 80°. An amount of gas input per minute through the bubble input port located in the first region is 5 L. A distance between the bubble input port located in the second region and the bottom of the electroplating bath is 0.2 m. The bubble input port located in the second region is oriented to a direction below a horizontal direction where the bubble input port is located. An included angle between an axis of the bubble input port located in the second region is located and the horizontal plane is 80°. An amount of gas input per minute through the bubble input port located in the second region is 5 L. A distance between the bubble input port and the cathode in a horizontal direction is 1.25 m.

[0080] The ultrasonic treatment is performed by an ultrasonic device. The ultrasonic device is located in the first region and between the bubble input port and the cathode. A distance between the ultrasonic device and the cathode in a horizontal direction is 0.5 m, and an ultrasonic frequency is 40 kHz.

Embodiment 3

[0081] The present embodiment provides a plating solution dispersion method of a graphene-silver plating solution. The method includes:
electroplating in an electroplating bath by using a graphene-silver plating solution. An opening size of the electroplating bath is 2m×2m, a vertical depth of the plating solution is 1.5 m, and a concentration of graphene in the plating solution is 10 g/L. During electroplating, hydrogen is intermittently input to the plating solution, a duration of a single hydrogen input is 6 min, the diameter of the input bubble is 1000 µm, the intermittent time between the bubble inputs is 20 min, the graphene-silver plating solution is subjected to ultrasonic treatment after 10 s of an initial bubble input, the duration of a single ultrasonic treatment is 6 min, and the intermittent time between the ultrasonic treatments is 20 min.

[0082] The bubbles are input through two bubble input ports. The two bubble input ports are located on one side of an anode away from a cathode and is oriented towards the cathode. The two bubble input ports are respectively located in a first region and a second region of the plating solution. The two bubble input ports are located on the same vertical axis in a vertical direction. A distance between the bubble input port located in the first region and the bottom of the electroplating bath is 0.4 m. The bubble input port located in the first region is oriented to a direction above a horizontal direction where the bubble input port is located. An included angle between an axis of the bubble input port located in the first region and a horizontal plane is 60°. An amount of gas input per minute through the bubble input port located in the first region is 40 L. A distance between the bubble input port located in the second region and the bottom of the electroplating bath is 0.2 m. The bubble input port located in the second region is oriented to a direction below a horizontal direction where the bubble input port is located. An included angle between an axis of the bubble input port located in the second region is located and the horizontal plane is 60°. An amount of gas input per minute through the bubble input port located in the second region is 40 L. A distance between the bubble input port and the cathode in a horizontal direction is 1.25 m.

[0083] The ultrasonic treatment is performed by an ultrasonic device. The ultrasonic device is located in the first region and between the bubble input port and the cathode. A distance between the ultrasonic device and the cathode in a horizontal direction is 0.5 m, and an ultrasonic frequency is 50 kHz.

Embodiment 4

[0084] The present embodiment provides a plating solution dispersion method of a graphene-silver plating solution. The method includes:
electroplating in an electroplating bath by using a graphene-silver plating solution. An opening size of the electroplating bath is 1m×1m, a vertical depth of the plating solution is 1 m, and a concentration of graphene in the plating solution is 15 g/L. During electroplating, hydrogen is intermittently input to the plating solution, a duration of a single hydrogen input is 6 min, the diameter of the input bubble is 50 µm, the intermittent time between the bubble inputs is 10 min, the graphene-silver plating solution is subjected to ultrasonic treatment after 50 s of an initial bubble input, the duration of a single ultrasonic treatment is 6 min, and the intermittent time between the ultrasonic treatments is 10 min.

[0085] The bubbles are input through a bubble input port. The bubble input port is located on one side of an anode away from a cathode and is oriented towards the cathode. The bubble input port is located in a second region of the plating solution. A distance between the bubble input port and the bottom of the electroplating bath is 0.1 m. An amount of gas input per minute through the bubble input port is 40 L. A distance between the bubble input port and the cathode in a horizontal direction is 1.25 m.

[0086] The ultrasonic treatment is performed by an ultrasonic device. The ultrasonic device is located in the first region and between the bubble input port and the cathode. A distance between the ultrasonic device and the cathode in a horizontal direction is 0.25 m, and an ultrasonic frequency is 45 kHz.

[0087] The technical solution provided by the embodiments of the present application are introduced above in detail. Specific examples are used herein to illustrate the principles and embodiments of the present application. The description of the above embodiments is only used to help the understanding of the methods and core ideas of the present application. At the same time, for those skill in the art, according to the ideas of the present application, there will be changes in the specific embodiments and the scope of application. In summary, the content of the present description should not be construed as a limitation of the present invention.

Claims

1. A plating solution dispersion method, comprising:
intermittently inputting bubbles into a plating solution in the case of electroplating, and intermittently performing an ultrasonic treatment on the plating solution in the process of intermittently inputting the bubbles, wherein at least some of the bubbles are within an ultrasound influence range.

2. The plating solution dispersion method according to claim 1, wherein the ultrasonic treatment is performed once in the process of a single bubble input.

3. The plating solution dispersion method according to claim 1, wherein a duration of the single bubble input is 0.1 to 6 min, and a duration of a single ultrasonic treatment is 1 to 6 min; and when the bubbles are input, a total amount of gas input per minute is 10 to 80 L.

4. The plating solution dispersion method according to claim 1, wherein the intermittent time between the bubble inputs is 5 to 20 min; and the intermittent time between the ultrasonic treatments is 1 to 20 min.

5. The plating solution dispersion method according to claim 1, wherein in the process of the single bubble input, the ultrasonic treatment is performed 10 to 50 s after an initial bubble input.

6. The plating solution dispersion method according to claim 1, wherein the plating solution comprises solid particles, and a material of the solid particles is selected from one or more of graphene, a metal oxide, and a non-metallic oxide; and when the bubbles are input, the input gas is selected from one or more of hydrogen, nitrogen, or air.

7. The plating solution dispersion method according to claim 1, wherein each bubble has a diameter of 0.01 to 1000 µm; or

the bubble has a diameter of 1 to 150 µm; or

the bubble has a diameter of 30 to 80 µm.

8. The plating solution dispersion method according to claim 1, wherein an ultrasonic frequency of the ultrasonic treatment is 40 to 50 kHz.

9. The plating solution dispersion method according to claim 1, wherein the input of the bubbles into the plating solution is implemented through a bubble input port, the plating solution is contained with a container, and a cathode and an anode which are spaced from each other are accommodated in the container;

the bubble input port is arranged between the cathode and the anode, and the bubble input port is close to the anode and away from the cathode; or

the cathode is located on one side of the anode away from a side wall of the container, the bubble input port is arranged between the anode and the side wall, and the bubble input port is close to the side wall and away from the anode.

10. The plating solution dispersion method according to claim 9, wherein the bubble input port is oriented to a direction where the cathode is located.

11. The plating solution dispersion method according to claim 9 or 10, wherein a plurality of bubble input ports is provided, and each bubble input port has a position height difference in a vertical direction.

12. The plating solution dispersion method according to claim 11, wherein two bubble input ports are provided; and the two bubble input ports are located in a first region and a second region respectively, wherein the first region is a region between a horizontal plane where a middle part of the cathode is located and a horizontal plane where a lower part of the cathode is located, and the second region is a region between the horizontal plane where the lower part of the cathode is located and a horizontal plane where the bottom of the container is located.

13. The plating solution dispersion method according to claim 12, wherein the bubble input port located in the first region is a first input port; the bubble input port located in the second region is a second input port; the first input port is oriented to a part above a horizontal plane where the first input port is located; and the second input port is oriented to a part below a horizontal plane where the second input port is located.

14. The plating solution dispersion method according to claim 13, wherein an included angle between an axis where the first input port is located and a horizontal plane is 30° to 80°; and an included angle between an axis where the second input port is located and the horizontal plane is 30° to 80°.

15. The plating solution dispersion method according to claim 14, wherein the ultrasonic treatment is implemented by an ultrasonic device, and the ultrasonic device is located in the first region; the ultrasonic device is located between the bubble input port and the cathode; and the ultrasonic device is close to the bubble input port and away from the cathode.

Drawing