(19)
(11) EP 4 584 785 A1

(12)

(43) Date of publication:
16.07.2025 Bulletin 2025/29

(21) Application number: 23762039.8

(22) Date of filing: 28.07.2023
(51) International Patent Classification (IPC): 
G11C 5/02(2006.01)
G11C 11/401(2006.01)
G11C 11/22(2006.01)
(52) Cooperative Patent Classification (CPC):
G11C 5/02; G11C 11/401; G11C 11/221
(86) International application number:
PCT/US2023/029044
(87) International publication number:
WO 2024/054316 (14.03.2024 Gazette 2024/11)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30) Priority: 09.09.2022 US 202263405347 P
19.05.2023 US 202318199837

(71) Applicant: Advanced Micro Devices, Inc.
Santa Clara, CA 95054 (US)

(72) Inventors:
  • PRASAD, Divya Madapusi Srinivas
    Santa Clara, California 95054 (US)
  • MADAN, Niti
    Austin, Texas 78735 (US)
  • IGNATOWSKI, Michael
    Austin, Texas 78735 (US)
  • LEE, Hyung-Dong
    Austin, Texas 78735 (US)

(74) Representative: Hancox, Jonathan Christopher et al
Venner Shipley LLP Windsor House 6-10 Mount Ephraim Road
Tunbridge Wells, Kent TN1 1EE
Tunbridge Wells, Kent TN1 1EE (GB)

   


(54) HYBRID MEMORY ARCHITECTURE FOR ADVANCED 3D SYSTEMS