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(11)

EP 4 681 368 A1

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(43) Date of publication: 21.01.2026 Bulletin 2026/04 (21) Application number: 23752140.6 (22) Date of filing: 14.07.2023

(51) International Patent Classification (IPC):  H04L 1/1822(2023.01) H04L 1/1867(2023.01) H04L 1/1829(2023.01) (52) Cooperative Patent Classification (CPC): H04L 1/1864; H04L 1/1822; H04L 1/188 (86) International application number: PCT/US2023/070257 (87) International publication number: WO 2024/196424 (26.09.2024 Gazette 2024/39)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (30) Priority: 17.03.2023 US 202363490991 P 13.07.2023 US 202318352063 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)

(72) Inventors: ZACHARIAS, Leena San Diego, California 92121 (US) MEYLAN, Arnaud San Diego, California 92121 (US) WADHWA, Deepak San Diego, California 92121 (US) KANAMARLAPUDI, Sitaramanjaneyulu San Diego, California 92121 (US) AYDIN, Levent San Diego, California 92121 (US) KIM, Hobin San Diego, California 92121 (US) (74) Representative: Tomkins & Co  5 Dartmouth Road Dublin 6, D06 F9C7 Dublin 6, D06 F9C7 (IE)