(19)
(11) EP 4 681 447 A1

(12)

(43) Date of publication:
21.01.2026 Bulletin 2026/04

(21) Application number: 23926808.9

(22) Date of filing: 16.03.2023
(51) International Patent Classification (IPC): 
H04W 4/70(2018.01)
(52) Cooperative Patent Classification (CPC):
H04W 4/70; H04W 4/44
(86) International application number:
PCT/CN2023/081890
(87) International publication number:
WO 2024/187454 (19.09.2024 Gazette 2024/38)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(71) Applicant: QUALCOMM Incorporated
San Diego, CA 92121-1714 (US)

(72) Inventors:
  • GUO, Hui
    San Diego, CA 92121-1714 (US)
  • NGUYEN, Tien Viet
    San Diego, CA 92121-1714 (US)
  • SARKIS, Gabi
    San Diego, CA 92121-1714 (US)
  • WU, Shuanshuan
    San Diego, CA 92121-1714 (US)
  • GULATI, Kapil
    San Diego, CA 92121-1714 (US)

(74) Representative: Tomkins & Co 
5 Dartmouth Road
Dublin 6, D06 F9C7
Dublin 6, D06 F9C7 (IE)

   


(54) UPLINK AGGREGATION FOR DEVICES IN WIRELESS SYSTEMS