(19)
(11) EP 4 681 506 A1

(12)

(43) Date of publication:
21.01.2026 Bulletin 2026/04

(21) Application number: 24712982.8

(22) Date of filing: 14.03.2024
(51) International Patent Classification (IPC): 
H05K 1/02(2006.01)
H01R 13/646(2011.01)
H05K 1/11(2006.01)
H01R 13/6587(2011.01)
(52) Cooperative Patent Classification (CPC):
H01R 13/6587; H01R 13/646; H05K 1/0219; H05K 1/117; H05K 1/025; H05K 2201/09409; H05K 2201/09709; H05K 2201/09663; H05K 2201/09781; H05K 1/0248; H05K 2201/09263
(86) International application number:
PCT/IB2024/052490
(87) International publication number:
WO 2024/189573 (19.09.2024 Gazette 2024/38)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 14.03.2023 US 202363490014 P
28.02.2024 US 202418589470

(71) Applicant: TE Connectivity Solutions GmbH
8200 Schaffhausen (CH)

(72) Inventors:
  • WALTON, Scott Eric
    MIDDLETOWN, Pennsylvania 17057 (US)
  • MILLER, Keith Edwin
    MIDDLETOWN, Pennsylvania 17057 (US)
  • CHAMPION, Bruce Allen
    MIDDLETOWN, Pennsylvania 17057 (US)
  • CINA, Michael Frank
    MIDDLETOWN, Pennsylvania 17057 (US)
  • ROSENAU, Joshua Allen
    MIDDLETOWN, Pennsylvania 17057 (US)
  • GINGRICH III, Charles Raymond
    MIDDLETOWN, Pennsylvania 17057 (US)

(74) Representative: Johnstone, Edward Ian et al
Baron Warren Redfern LLP 1000 Great West Road
Brentford TW8 9DW
Brentford TW8 9DW (GB)

   


(54) STRIPLINE WAFER FOR WAFER BASED CONNECTOR SYSTEM