(19)
(11) EP 4 739 417 A1

(12)

(43) Date of publication:
13.05.2026 Bulletin 2026/20

(21) Application number: 24755293.8

(22) Date of filing: 13.08.2024
(51) International Patent Classification (IPC): 
B01D 19/00(2006.01)
B23K 26/38(2014.01)
C02F 1/20(2023.01)
B23K 26/70(2014.01)
(52) Cooperative Patent Classification (CPC):
B23K 26/703; B23K 26/38; B23K 26/123; B01D 5/0003; H01S 3/0407
(86) International application number:
PCT/EP2024/072821
(87) International publication number:
WO 2025/040518 (27.02.2025 Gazette 2025/09)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 18.08.2023 EP 23192232

(71) Applicant: Bystronic Laser AG
3362 Niederönz (CH)

(72) Inventors:
  • AMSTAD, Beat
    3366 Bettenhausen (CH)
  • GFELLER, Robert
    3074 Muri bei Bern (CH)
  • LÜDI, Andreas
    3400 Burgdorf (CH)

(74) Representative: Frei Patent Attorneys 
Frei Patentanwaltsbüro AG Hagenholzstrasse 85
8050 Zürich
8050 Zürich (CH)

   


(54) LASER PROCESSING SYSTEM, AND METHOD