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(11)

EP 4 739 509 A1

(12)

(43) Date of publication: 13.05.2026 Bulletin 2026/20 (21) Application number: 23748874.7 (22) Date of filing: 03.07.2023

(51) International Patent Classification (IPC):  B41J 2/175(2006.01) (52) Cooperative Patent Classification (CPC): B41J 2/1753; H05K 1/118 (86) International application number: PCT/US2023/026868 (87) International publication number: WO 2025/010056 (09.01.2025 Gazette 2025/02)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (71) Applicant: Hewlett-Packard Development Company, L.P. Spring TX 77389 (US)	(72) Inventors: QUINN, Max Corvallis, Oregon 97330-4241 (US) BAHNSEN, Kyle Vancouver, Washington 98683 (US) MCCOURT, Zachary T. 14100 Pulau Pinang (MY) STUMBO, Samuel Corvallis, Oregon 97330-4241 (US) SCHWEITZER, Paul Corvallis, Oregon 97330-4241 (US) (74) Representative: Hoffmann Eitle  Patent- und Rechtsanwälte PartmbB Arabellastraße 30 81925 München 81925 München (DE)