(19)
(11) EP 4 739 510 A1

(12)

(43) Date of publication:
13.05.2026 Bulletin 2026/20

(21) Application number: 23750801.5

(22) Date of filing: 03.07.2023
(51) International Patent Classification (IPC): 
B41J 2/175(2006.01)
(52) Cooperative Patent Classification (CPC):
B41J 2/17513; B41J 2/17553; B41J 2/17523; B41J 2/1753
(86) International application number:
PCT/US2023/026871
(87) International publication number:
WO 2025/010058 (09.01.2025 Gazette 2025/02)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(71) Applicant: Hewlett-Packard Development Company, L.P.
Spring TX 77389 (US)

(72) Inventors:
  • STUDER, Anthony D.
    Corvallis, Oregon 97330-4241 (US)
  • BELL, Jeffrey F.
    Corvallis, Oregon 97330-4241 (US)
  • QUINN, Max
    Corvallis, Oregon 97330-4241 (US)
  • LEISER, Judson M.
    Corvallis, Oregon 97330-4241 (US)
  • ENDER, Ronald J.
    Corvallis, Oregon 97330-4241 (US)

(74) Representative: Hoffmann Eitle 
Patent- und Rechtsanwälte PartmbB Arabellastraße 30
81925 München
81925 München (DE)

   


(54) MOLDED BODY FOR FLUID EJECTION DEVICE ASSEMBLY