(19)
(11) EP 4 740 241 A1

(12)

(43) Date of publication:
13.05.2026 Bulletin 2026/20

(21) Application number: 24854904.0

(22) Date of filing: 15.08.2024
(51) International Patent Classification (IPC): 
H01L 23/367(2006.01)
H01L 23/495(2006.01)
H01L 23/46(2006.01)
(52) Cooperative Patent Classification (CPC):
H10W 70/02; H10W 40/10; H10W 70/461; H10W 70/481; H10W 72/30
(86) International application number:
PCT/US2024/042398
(87) International publication number:
WO 2025/038797 (20.02.2025 Gazette 2025/08)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 15.08.2023 US 202363532707 P
03.04.2024 US 202463573525 P

(71) Applicant: American Axle & Manufacturing, Inc.
Detroit, MI 48211-1198 (US)

(72) Inventors:
  • DOWNS, James P.
    South Lyon, MI 48178 (US)
  • VALENTE, Paul J.
    Berkley, MI 48072 (US)
  • RONNING, Jeffrey J.
    Grosse Pointe Farms, MI 48236 (US)
  • CRECELIUS, David R.
    Cicero, IN 46034 (US)
  • STUART, Charles G.
    Rochester Hills, MI 48309 (US)

(74) Representative: Staeger & Sperling Partnerschaftsgesellschaft mbB 
Sonnenstraße 19
80331 München
80331 München (DE)

   


(54) HEAT-SINKED POWER SEMICONDUCTOR WITH FOLDED FIN HEATSINK