(19)
(11) EP 4 740 247 A1

(12)

(43) Date of publication:
13.05.2026 Bulletin 2026/20

(21) Application number: 24746857.2

(22) Date of filing: 28.06.2024
(51) International Patent Classification (IPC): 
H01L 23/498(2006.01)
H01L 21/48(2006.01)
H01L 21/56(2006.01)
(52) Cooperative Patent Classification (CPC):
H10P 72/7424; H10W 70/093; H10W 70/05; H10W 74/01; H10W 90/701; H10W 72/072
(86) International application number:
PCT/US2024/036074
(87) International publication number:
WO 2025/010196 (09.01.2025 Gazette 2025/02)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 05.07.2023 US 202363511941 P

(71) Applicant: Qorvo US, Inc.
Greensboro, NC 27409 (US)

(72) Inventors:
  • KO, Yong-Jae
    Seoul Seoul 06178 (KR)
  • MORRIS, Thomas, Scott
    Greensboro, North Carolina 27409 (US)
  • CALHOUN, Brian, Howard
    Greensboro, North Carolina 27409 (US)
  • ORLOWSKI, John, August
    Greensboro, North Carolina 27409 (US)
  • WILLIS, Don
    Greensboro, North Carolina 27409 (US)
  • CARPENTER, Charles, E.
    Apopka, Florida 32703 (US)

(74) Representative: D Young & Co LLP 
3 Noble Street
London EC2V 7BQ
London EC2V 7BQ (GB)

   


(54) METHOD TO ENABLE DOUBLE-SIDE MOLDED MODULE WITH PLATED COPPER POSTS