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EP 4 740 702 A1

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(43) Date of publication: 13.05.2026 Bulletin 2026/20 (21) Application number: 23748154.4 (22) Date of filing: 03.07.2023

(51) International Patent Classification (IPC):  H05K 1/11(2006.01) B41J 2/175(2006.01) B41J 2/14(2006.01) H05K 1/18(2026.01) (52) Cooperative Patent Classification (CPC): B41J 2/14072; H05K 1/118; H05K 1/189; B41J 2/1753; H05K 1/111; H05K 2201/056; H05K 2201/09236; H05K 2201/09727; H05K 2201/2009 (86) International application number: PCT/US2023/026869 (87) International publication number: WO 2025/010057 (09.01.2025 Gazette 2025/02)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (71) Applicant: Hewlett-Packard Development Company, L.P. Spring TX 77389 (US)

(72) Inventors: QUINN, Max Corvallis, 97330-4241 (US) BAHNSEN, Kyle Vancouver, Washington 98683 (US) SCHWEITZER, Paul Corvallis, 97330-4241 (US) CUMBIE, Michael W. Corvallis, 97330-4241 (US) GARDNER, James Corvallis, 97330-4241 (US) MCCOURT, Zachary T. Corvallis, 97330-4241 (US) STUMBO, Samuel Corvallis, 97330-4241 (US) (74) Representative: Hoffmann Eitle  Patent- und Rechtsanwälte PartmbB Arabellastraße 30 81925 München 81925 München (DE)