(19)
(11) EP 4 740 708 A1

(12)

(43) Date of publication:
13.05.2026 Bulletin 2026/20

(21) Application number: 24835622.2

(22) Date of filing: 12.06.2024
(51) International Patent Classification (IPC): 
H05K 7/20(2006.01)
H05K 10/00(2006.01)
(52) Cooperative Patent Classification (CPC):
H05K 7/20336
(86) International application number:
PCT/IN2024/050796
(87) International publication number:
WO 2025/008901 (09.01.2025 Gazette 2025/02)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 03.07.2023 IN 202321044625

(71) Applicant: Jio Platforms Limited
Ahmedabad, Gujarat 380006 (IN)

(72) Inventors:
  • SHAH, Brijesh
    Gujarat Ahmedabad 380006 (IN)
  • BHATNAGAR, Aayush
    Gujarat Ahmedabad 380006 (IN)
  • BHATNAGAR, Pradeep Kumar
    Gujarat Ahmedabad 380006 (IN)
  • VERMA, Vijay Mohan
    Gujarat Ahmedabad 380006 (IN)
  • MULLA, Lalesa
    Gujarat Ahmedabad 380006 (IN)
  • SINGH, Bajinder Pal
    Gujarat Ahmedabad 380006 (IN)
  • GUPTA, Sumit
    Gujarat Ahmedabad 380006 (IN)

(74) Representative: Goddar, Heinz J. 
Boehmert & Boehmert Anwaltspartnerschaft mbB Pettenkoferstrasse 22
80336 München
80336 München (DE)

   


(54) HEAT DISSIPATION ASSEMBLY FOR COMMUNICATION DEVICE