(19)
(11) EP 4 770 736 A1

(12)

(43) Date of publication:
08.07.2026 Bulletin 2026/28

(21) Application number: 24754772.2

(22) Date of filing: 18.07.2024
(51) International Patent Classification (IPC): 
A61N 1/36(2006.01)
H01L 23/498(2006.01)
A61N 1/375(2006.01)
(52) Cooperative Patent Classification (CPC):
A61N 1/36125; A61N 1/3758; H10W 70/68; H10W 70/60; H10W 90/701; H10W 72/00; H10W 70/635
(86) International application number:
PCT/IB2024/056965
(87) International publication number:
WO 2025/046333 (06.03.2025 Gazette 2025/10)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 31.08.2023 US 202363535806 P

(71) Applicant: Medtronic, Inc.
Minneapolis, Minnesota 55432 (US)

(72) Inventors:
  • WASSON, James R.
    Minneapolis, Minnesota 55432 (US)
  • HENSCHEL, Mark E.
    Minneapolis, Minnesota 55432 (US)
  • SHI, Songhua
    Minneapolis, Minnesota 55432 (US)
  • DELEON, Christine M.
    Minneapolis, Minnesota 55432 (US)
  • WHEELER, Jeff M.
    Minneapolis, Minnesota 55432 (US)
  • HANLY, Matthew P.
    Minneapolis, Minnesota 55432 (US)

(74) Representative: Zimmermann & Partner Patentanwälte mbB 
P.O. Box 330 920
80069 München
80069 München (DE)

   


(54) INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME