(19)
(11) EP 4 771 112 A1

(12)

(43) Date of publication:
08.07.2026 Bulletin 2026/28

(21) Application number: 23950106.7

(22) Date of filing: 30.08.2023
(51) International Patent Classification (IPC): 
C09J 183/06(2006.01)
C08L 83/05(2006.01)
C08L 83/07(2006.01)
C08L 83/04(2006.01)
C08L 83/06(2006.01)
(52) Cooperative Patent Classification (CPC):
C08L 83/04; C08G 77/20; C08G 77/12; C08G 77/70; C08K 2003/2227; C08K 2003/2296; C09D 183/04; C08K 2201/001
 
C-Sets:
C08L 83/04, C08L 83/00, C08L 83/00, C08K 5/5415, C08K 2201/001, C08K 5/56;
(86) International application number:
PCT/CN2023/115674
(87) International publication number:
WO 2025/043515 (06.03.2025 Gazette 2025/10)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(71) Applicant: Dow Silicones Corporation
Midland, Michigan 48686 (US)

(72) Inventors:
  • HUANG, Yan
    Shanghai 201203 (CN)
  • BHAGWAGAR, Dorab Edul
    Auburn Michigan 48611 (US)
  • CHEN, Chen
    Shanghai 201203 (CN)
  • CAO, Zhongwei
    Shanghai 201203 (CN)

(74) Representative: Elkington and Fife LLP 
Prospect House 8 Pembroke Road
Sevenoaks, Kent TN13 1XR
Sevenoaks, Kent TN13 1XR (GB)

   


(54) ADDITION CURABLE THERMALLY CONDUCTIVE ORGANOPOLYSILOXANE ADHESIVE COMPOSITION