(19)
(11) EP 4 771 602 A1

(12)

(43) Date of publication:
08.07.2026 Bulletin 2026/28

(21) Application number: 23950184.4

(22) Date of filing: 31.08.2023
(51) International Patent Classification (IPC): 
G06V 20/58(2022.01)
B60W 30/095(2012.01)
(52) Cooperative Patent Classification (CPC):
G06V 20/58; B60W 40/10
(86) International application number:
PCT/CN2023/116119
(87) International publication number:
WO 2025/043599 (06.03.2025 Gazette 2025/10)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(71) Applicant: Qualcomm Incorporated
San Diego, CA 92121-1714 (US)

(72) Inventors:
  • XIE, Ronglu
    San Diego, CA 92121-1714 (US)
  • LEI, Ming
    San Diego, CA 92121-1714 (US)

(74) Representative: Reddie & Grose LLP 
The White Chapel Building 10 Whitechapel High Street
London E1 8QS
London E1 8QS (GB)

   


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