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(11)

EP 4 771 780 A1

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(43) Date of publication: 08.07.2026 Bulletin 2026/28 (21) Application number: 23950179.4 (22) Date of filing: 31.08.2023

(51) International Patent Classification (IPC):  H04B 7/08(2006.01) (52) Cooperative Patent Classification (CPC): H04B 7/0691; H04B 7/0695; G01S 2013/0254; G01S 13/4454; H01Q 21/062; H01Q 21/24; H01Q 3/26 (86) International application number: PCT/CN2023/116084 (87) International publication number: WO 2025/043592 (06.03.2025 Gazette 2025/10)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: DAI, Jing San Diego, California 92121-1714 (US) HUANG, Min San Diego, California 92121-1714 (US) YIN, Mingxi San Diego, California 92121-1714 (US) (74) Representative: Reddie & Grose LLP  The White Chapel Building 10 Whitechapel High Street London E1 8QS London E1 8QS (GB)