(19)

(11)

EP 4 771 901 A1

(12)

(43) Date of publication: 08.07.2026 Bulletin 2026/28 (21) Application number: 23950060.6 (22) Date of filing: 29.08.2023

(51) International Patent Classification (IPC):  H04W 24/08(2009.01) H04W 8/22(2009.01) (52) Cooperative Patent Classification (CPC): H04W 8/24; H04W 24/10 (86) International application number: PCT/CN2023/115404 (87) International publication number: WO 2025/043466 (06.03.2025 Gazette 2025/10)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: REN, Yuwei San Diego California 92121-1714 (US) DUAN, Weimin San Diego California 92121-1714 (US) XU, Huilin San Diego California 92121-1714 (US) (74) Representative: Reddie & Grose LLP  The White Chapel Building 10 Whitechapel High Street London E1 8QS London E1 8QS (GB)