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(11)

EP 4 771 911 A1

(12)

(43) Date of publication: 08.07.2026 Bulletin 2026/28 (21) Application number: 23950272.7 (22) Date of filing: 01.09.2023

(51) International Patent Classification (IPC):  H04W 28/06(2009.01) (52) Cooperative Patent Classification (CPC): H04R 2420/07; H04L 65/70; G10L 19/012; G10L 25/78 (86) International application number: PCT/CN2023/116423 (87) International publication number: WO 2025/043695 (06.03.2025 Gazette 2025/10)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: KH MA MD TN (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: LIU, Runyuan San Diego California 92121-1714 (US) ZENG, Jie San Diego California 92121-1714 (US) AGARWAL, Vishal San Diego California 92121-1714 (US) BATRA, Mayank San Diego California 92121-1714 (US) (74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte  Prinzregentenplatz 7 81675 München 81675 München (DE)