(19)
(11) EP 4 805 985 A1

(12)

(43) Date of publication:
16.09.2026 Bulletin 2026/38

(21) Application number: 24739863.9

(22) Date of filing: 11.06.2024
(51) International Patent Classification (IPC): 
H01L 25/065(2023.01)
H01L 23/538(2006.01)
H01L 23/498(2006.01)
H01L 25/18(2023.01)
(52) Cooperative Patent Classification (CPC):
H10W 90/701; H10W 70/635; H10W 70/611; H10W 70/685; H10W 90/401; H10W 90/00; H10W 72/01; H10W 90/22; H10W 90/291; H10W 90/288; H10W 70/618
(86) International application number:
PCT/US2024/033342
(87) International publication number:
WO 2025/101227 (15.05.2025 Gazette 2025/20)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 07.11.2023 US 202363596709 P
25.03.2024 US 202418615918

(71) Applicant: Advanced Micro Devices, Inc.
Santa Clara, CA 95054 (US)

(72) Inventors:
  • KULKARNI, Deepak Vasant
    Austin, Texas 78735 (US)
  • SMITH, Alan D.
    Austin, Texas 78735 (US)
  • SWAMINATHAN, Raja
    Austin, Texas 78735 (US)

(74) Representative: Marks & Clerk LLP 
15 Fetter Lane
London EC4A 1BW
London EC4A 1BW (GB)

   


(54) CHIP PACKAGE WITH ACTIVE SILICON BRIDGE