(19)
(11) EP 4 816 600 A1

(12)

(43) Date of publication:
07.10.2026 Bulletin 2026/41

(21) Application number: 24812836.5

(22) Date of filing: 25.11.2024
(51) International Patent Classification (IPC): 
C25D 3/38(2006.01)
 C25D 7/12(2006.01)
(52) Cooperative Patent Classification (CPC):
C25D 3/38; C25D 7/123
(86) International application number:
PCT/EP2024/083467
(87) International publication number:
WO 2025/114220 (05.06.2025 Gazette 2025/23)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 30.11.2023 EP 23213528

(71) Applicant: BASF SE
67056 Ludwigshafen am Rhein (DE)

(72) Inventors:
  • EMNET, Charlotte
    67056 Ludwigshafen am Rhein (DE)
  • ARNOLD, Marco
    67056 Ludwigshafen am Rhein (DE)
  • FLUEGEL, Alexander
    67056 Ludwigshafen am Rhein (DE)
  • ENGELHARDT, Nadine
    67056 Ludwigshafen am Rhein (DE)

(74) Representative: BASF IP Association 
BASF SE GBI - Z0078
67056 Ludwigshafen
67056 Ludwigshafen (DE)

   


(54) NON-ACIDIC COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT REDUCTION AGENT