(19)
(11) EP 4 816 759 A1

(12)

(43) Date of publication:
07.10.2026 Bulletin 2026/41

(21) Application number: 23833582.2

(22) Date of filing: 01.12.2023
(51) International Patent Classification (IPC): 
F28D 15/02(2006.01)
F28F 3/02(2006.01)
H01L 23/367(2006.01)
H01L 23/467(2006.01)
F28D 15/04(2006.01)
F28F 3/06(2006.01)
H01L 23/427(2006.01)
(52) Cooperative Patent Classification (CPC):
F28D 15/0233; F28D 15/0275; F28D 15/04; F28F 3/025; F28F 3/06; F28F 2250/08; H10W 40/226; H10W 40/22; H10W 40/43; H10W 40/73
(86) International application number:
PCT/CN2023/135835
(87) International publication number:
WO 2025/112033 (05.06.2025 Gazette 2025/23)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(71) Applicant: QUALCOMM INCORPORATED
San Diego, California 92121-1714 (US)

(72) Inventors:
  • CAO, Yan
    San Diego California 92121-1714 (US)
  • HE, Hui
    San Diego California 92121-1714 (US)
  • TANG, Wei
    San Diego California 92121-1714 (US)
  • YE, Feihu
    San Diego California 92121-1714 (US)

(74) Representative: Wagner & Geyer 
Partnerschaft mbB Patent- und Rechtsanwälte Gewürzmühlstrasse 5
80538 München
80538 München (DE)

   


(54) HEAT DISSIPATION DEVICE EMPLOYING A HEAT TRANSFER CHAMBER WITH OPENING (S) FOR IMPROVED HEAT SINK AIR FLOW AND HEAT DISSIPATION, AND RELATED ASSEMBLY METHODS