(19)
(11) EP 4 816 836 A1

(12)

(43) Date of publication:
07.10.2026 Bulletin 2026/41

(21) Application number: 25762502.0

(22) Date of filing: 21.02.2025
(51) International Patent Classification (IPC): 
G01R 31/28(2006.01)
G01J 5/48(2022.01)
H04N 5/33(2023.01)
G01R 1/073(2006.01)
(52) Cooperative Patent Classification (CPC):
G01R 31/2868; G01R 31/2874; G01R 31/2891; G01J 2005/0077; G01J 5/0007; G01J 5/0831; H10P 74/207
(86) International application number:
PCT/SG2025/050119
(87) International publication number:
WO 2025/183630 (04.09.2025 Gazette 2025/36)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 28.02.2024 JP 2024028801

(71) Applicant: Teradyne (Asia) Pte Ltd
Singapore 117586 (SG)

(72) Inventor:
  • FUKUSHIMA, Tatsuyuki
    Aso-gun Kumamoto-ken, 861-2402 (JP)

(74) Representative: Fish & Richardson P.C. 
Highlight Business Towers Mies-van-der-Rohe-Straße 8
80807 München
80807 München (DE)

   


(54) SEMICONDUCTOR TESTING DEVICE AND WAFER PROBER