(19)

(11)

EP 4 817 089 A1

(12)

(43) Date of publication: 07.10.2026 Bulletin 2026/41 (21) Application number: 24828204.8 (22) Date of filing: 11.11.2024

(51) International Patent Classification (IPC):  H01L 21/48(2006.01) H01L 23/538(2006.01) H01L 25/07(2006.01) H01L 23/498(2006.01) H01L 25/065(2023.01) H01L 25/075(2006.01) (52) Cooperative Patent Classification (CPC): H10W 70/05; H10W 90/701; H10W 70/685; H10W 70/611; H10W 70/635; H10W 90/401; H10W 70/65; H10W 90/724; H10W 70/60; H10W 90/00; H10W 70/63; H10W 70/618 (86) International application number: PCT/US2024/055374 (87) International publication number: WO 2025/117170 (05.06.2025 Gazette 2025/23)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA Designated Validation States: GE KH MA MD TN (30) Priority: 30.11.2023 US 202318524571 (71) Applicant: QUALCOMM INCORPORATED San Diego, California 92121-1714 (US)	(72) Inventors: BUOT, Joan Rey Villarba San Diego, California 92121 (US) WE, Hong Bok San Diego, California 92121 (US) WANG, Zhijie San Diego, California 92121 (US) LEE, Sang-Jae San Diego, California 92121 (US) (74) Representative: Wagner & Geyer  Partnerschaft mbB Patent- und Rechtsanwälte Gewürzmühlstrasse 5 80538 München 80538 München (DE)