(19)
(11) EP 4 817 094 A1

(12)

(43) Date of publication:
07.10.2026 Bulletin 2026/41

(21) Application number: 24898671.3

(22) Date of filing: 26.11.2024
(51) International Patent Classification (IPC): 
H01L 23/373(2006.01)
H01L 21/02(2006.01)
H10D 62/85(2025.01)
H01L 23/48(2006.01)
(52) Cooperative Patent Classification (CPC):
H10P 14/6902; H10P 14/6532; H10P 14/6336; H10W 40/228; H10W 40/254
(86) International application number:
PCT/US2024/057546
(87) International publication number:
WO 2025/117597 (05.06.2025 Gazette 2025/23)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 01.12.2023 US 202363605071 P

(71) Applicant: The Board of Trustees of the Leland Stanford Junior University
Stanford, CA 94305-2038 (US)

(72) Inventors:
  • MALAKOUTIAN, Mohamadali
    Redwood City, CA 94063 (US)
  • CHOWDHURY, Srabanti
    San Ramon, CA 94583 (US)
  • KASPEROVICH, Anna
    Redwood City, CA 94063 (US)

(74) Representative: Hancox, Jonathan Christopher et al
Venner Shipley LLP Windsor House 6-10 Mount Ephraim Road
Tunbridge Wells, Kent TN1 1EE
Tunbridge Wells, Kent TN1 1EE (GB)

   


(54) SEMICONDUCTORS DEVICES, AND THEIR MANUFACTURE, INCLUDING THERMAL-PATHWAY VIAS