(19)
(11) EP 4 817 098 A1

(12)

(43) Date of publication:
07.10.2026 Bulletin 2026/41

(21) Application number: 24813559.2

(22) Date of filing: 11.11.2024
(51) International Patent Classification (IPC): 
H01L 23/485(2006.01)
(52) Cooperative Patent Classification (CPC):
H10W 72/01235; H10W 72/01255; H10W 72/232; H10W 72/242; H10W 72/245; H10W 72/223; H10W 72/237; H10W 72/248; H10W 72/227; H10W 72/07253; H10W 90/724; H10W 72/07252; H10W 72/07254; H10W 72/20
(86) International application number:
PCT/US2024/055355
(87) International publication number:
WO 2025/117168 (05.06.2025 Gazette 2025/23)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 01.12.2023 US 202318526165

(71) Applicant: QUALCOMM INCORPORATED
San Diego, California 92121-1714 (US)

(72) Inventors:
  • HU, Wei
    San Diego, California 92121 (US)
  • HE, Dongming
    San Diego, California 92121 (US)
  • LI, Zhaozhi
    San Diego, California 92121 (US)
  • SUN, Yangyang
    San Diego, California 92121 (US)

(74) Representative: Bardehle Pagenberg Partnerschaft mbB Patentanwälte Rechtsanwälte 
Prinzregentenplatz 7
81675 München
81675 München (DE)

   


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