(19)
(11) EP 4 817 101 A1

(12)

(43) Date of publication:
07.10.2026 Bulletin 2026/41

(21) Application number: 24898501.2

(22) Date of filing: 18.11.2024
(51) International Patent Classification (IPC): 
H01L 25/065(2023.01)
H10B 80/00(2026.01)
(52) Cooperative Patent Classification (CPC):
H10W 20/20; H10W 90/792; H10W 80/312; H10W 90/00; H10W 90/297
(86) International application number:
PCT/US2024/056340
(87) International publication number:
WO 2025/117230 (05.06.2025 Gazette 2025/23)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
GE KH MA MD TN

(30) Priority: 01.12.2023 US 202318526418

(71) Applicant: Advanced Micro Devices, Inc.
Santa Clara, CA 95054 (US)

(72) Inventors:
  • SCHREIBER, Russell
    Austin, Texas 78735 (US)
  • WUU, John
    Fort Collins, Colorado 80528 (US)
  • OLIVER, Spence
    Austin, Texas 78735 (US)

(74) Representative: Marks & Clerk LLP 
15 Fetter Lane
London EC4A 1BW
London EC4A 1BW (GB)

   


(54) SEMICONDUCTOR DEVICES AND SYSTEMS INCLUDING STACKED LOGIC DIES